M2GL090TS-FGG676I

The M2GL090TS-FGG676I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology, offered in a 676‑BGA package. It provides a large logic capacity and on-chip memory alongside a high I/O count for designs that require significant programmable logic and interfacing.

Built and specified for industrial use, this device combines 86,184 logic elements with approximately 2.65 Mbits of embedded memory and support for up to 425 I/O. Its wide supply voltage range and extended operating temperature make it suitable for demanding embedded and industrial applications that need robust, reprogrammable logic capacity.

Key Features

• Core Logic  86,184 logic elements provide substantial programmable logic resources for complex digital functions.
• Embedded Memory  Approximately 2.65 Mbits of on‑chip RAM supports data buffering, state storage, and local memory requirements.
• I/O Capacity  Up to 425 I/O pins enable extensive peripheral interfacing, bus bridging, and multi‑channel connectivity in a single device.
• Power and Voltage  Supports a supply voltage range from 1.14 V to 2.625 V, allowing flexibility in system power design.
• Package and Mounting  Supplied in a 676‑BGA package (supplier device package: 676‑FBGA, 27×27) with surface‑mount mounting for compact board integration.
• Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
• Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use the device’s large logic capacity and industrial temperature rating for control, sequencing, and I/O aggregation in factory automation and machine control systems.
• Communications Equipment  High I/O count and embedded memory make it suitable for protocol bridging, packet processing, and interface adaptation in networking and telecom equipment.
• Instrumentation and Test  On‑chip RAM and plentiful logic elements support real‑time signal processing, data acquisition front ends, and custom measurement logic.
• Embedded Systems  Use as a centerpiece for complex embedded designs that require customizable logic, large I/O arrays, and reliable operation across industrial temperature ranges.

Unique Advantages

• Highly integrated logic and memory: Combines 86,184 logic elements with approximately 2.65 Mbits of embedded memory to consolidate functions and reduce external components.
• Extensive I/O capability: Up to 425 I/O pins enable broad peripheral and bus support without additional interface chips.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature‑variable environments.
• Flexible power domain support: Wide supply voltage range (1.14 V to 2.625 V) supports a variety of system power architectures.
• Compact BGA packaging: 676‑BGA (676‑FBGA, 27×27) provides a high‑density solution for space‑constrained boards while retaining robust signal routing.
• RoHS compliant: Meets common environmental compliance requirements for electronics manufacturing.

Why Choose M2GL090TS-FGG676I?

The M2GL090TS-FGG676I from Microchip Technology delivers a balanced combination of high logic capacity, on‑chip memory, and expansive I/O in a single industrial‑rated FPGA package. Its specifications make it well suited for engineers designing industrial control systems, communications equipment, instrumentation, and complex embedded applications that demand reliable operation across wide temperatures.

Choosing this FPGA can simplify board-level design by reducing the need for external logic and memory, while the RoHS compliance and surface‑mount 676‑BGA package support modern manufacturing processes. The device is a practical option for development teams seeking a scalable, reprogrammable platform with substantial on‑chip resources.

Request a quote or contact sales to obtain pricing, availability, and lead‑time information for the M2GL090TS-FGG676I.