M2GL090TS-FGG676

The M2GL090TS-FGG676 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology designed for high-density logic and I/O integration in surface-mount designs. It provides 86,184 logic elements and approximately 2.65 Mbits of embedded memory, making it suitable for designs that require substantial on-chip logic and memory resources while maintaining a compact 676-FBGA package.

This device targets commercial-grade embedded and system applications that need large I/O counts and flexible supply voltage options, while operating across a standard commercial temperature range.

Key Features

• Core Logic

  86,184 logic elements (LEs) for implementing complex custom logic and state machines.

• Embedded Memory

  Approximately 2.65 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive logic functions.

• I/O Capacity

  425 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and high-density signal routing.

• Power Supply Range

  Supports supply voltages from 1.14 V to 2.625 V to match a variety of system power rails and interfacing requirements.

• Package & Mounting

  676-FBGA package (27 × 27 mm) with surface-mount mounting for compact, high-density board layouts.

• Operating Conditions & Compliance

  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• High-density I/O interfacing

  Use the 425 I/Os to consolidate multiple peripheral connections and wide parallel buses in compact systems.

• Custom logic and protocol implementation

  Leverage 86,184 logic elements for implementing complex state machines, bridges, or protocol translators.

• Memory-backed processing

  Approximately 2.65 Mbits of on-chip RAM supports buffering, streaming data paths, and lookup-based algorithms.

• Compact system-in-package designs

  The 676-FBGA surface-mount package enables high-density PCB designs where board space is constrained.

Unique Advantages

• High logic capacity:

  86,184 logic elements provide headroom for complex designs and integration of multiple functions into a single device.

• Substantial on-chip memory:

  Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for many data-path and buffering tasks.

• Large I/O count:

  425 I/Os simplify system-level integration by supporting numerous interfaces without external I/O expanders.

• Flexible supply voltage:

  Support for 1.14 V to 2.625 V supplies allows integration with a range of system power architectures.

• Compact, manufacturable package:

  The 676-FBGA (27 × 27 mm) surface-mount package balances pin density with board-level assembly requirements.

• Commercial-grade qualification:

  Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose M2GL090TS-FGG676?

The M2GL090TS-FGG676 positions itself as a high-density FPGA option for commercial embedded designs that require substantial logic, memory, and I/O within a compact package. Its combination of 86,184 logic elements, approximately 2.65 Mbits of embedded memory, and 425 I/Os enables consolidation of multiple system functions onto a single device, reducing board complexity.

Backed by Microchip Technology, this IGLOO2 FPGA suits designers focused on scalable, compact implementations that must meet commercial temperature ranges and RoHS requirements while offering flexible supply voltage support for diverse system integrations.

Request a quote or submit an inquiry to purchase the M2GL090TS-FGG676 and discuss availability and lead times with our sales team.