M2GL090TS-FG676I

The M2GL090TS-FG676I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high logic capacity FPGA fabric combined with embedded memory and a large I/O count in a compact 676‑FBGA (27×27) package.

Designed for industrial applications, this device supports a broad supply voltage range of 1.14 V to 2.625 V and an operating temperature range of −40 °C to 100 °C, making it suitable for systems that require robust operation, significant on‑chip memory, and high I/O density.

Key Features

• Logic Capacity  Approximately 86,184 logic elements for implementing complex programmable logic and custom hardware functions.
• Embedded Memory  Approximately 2.65 Mbits of on‑chip RAM to support buffering, state storage, and local data processing.
• I/O Density  Up to 425 general‑purpose I/O pins to support multiple interfaces, sensor connections, and peripheral control.
• Power and Voltage  Flexible supply voltage range from 1.14 V to 2.625 V to accommodate different system power domains.
• Package and Mounting  676‑FBGA (27×27) package in a surface‑mount form factor for high‑density board layouts.
• Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Use the device’s industrial temperature range and high I/O count for motor control, PLC interfaces, and sensor aggregation.
• Communications and Networking  Leverage the large logic and I/O resources for protocol bridging, custom packet processing, and interface conversion.
• Embedded Processing and Acceleration  Implement custom accelerators, signal pre‑processing, or offload tasks from main processors using on‑chip logic and memory.

Unique Advantages

• High Logic Density: 86,184 logic elements enable implementation of complex digital functions and multiple concurrent subsystems on a single device.
• Substantial On‑Chip Memory: Approximately 2.65 Mbits of embedded RAM reduce external memory needs and improve data locality for performance‑sensitive designs.
• Extensive I/O Count: Up to 425 I/Os simplify integration with sensors, actuators, and peripheral devices without extensive multiplexing.
• Industrial Robustness: Rated for −40 °C to 100 °C operation and labeled industrial grade to support demanding environmental conditions.
• Flexible Power Options: Wide supply voltage range (1.14 V to 2.625 V) helps compatibility with varied system power architectures.
• Compact BGA Packaging: 676‑FBGA (27×27) footprint supports high‑density PCB designs while providing a reliable surface‑mount solution.

Why Choose M2GL090TS-FG676I?

The M2GL090TS-FG676I balances high logic capacity, meaningful embedded memory, and a large I/O complement in an industrial‑rated, RoHS‑compliant 676‑FBGA package. It is well suited for engineers developing industrial controls, communications equipment, and embedded acceleration solutions that require on‑board memory, extensive interfacing, and reliable operation across a wide temperature range.

This IGLOO2 FPGA option provides the platform-level resources needed to consolidate functions, reduce external components, and maintain system robustness, making it a practical choice for designs that demand scalability and integration within an industrial context.

Request a quote or submit an inquiry for pricing and availability of the M2GL090TS-FG676I to move your design forward.