M2GL090TS-FCSG325I

The M2GL090TS-FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM, and 180 user I/O in a 325-FCBGA (11×11) surface-mount package.

Engineered for industrial environments, the device supports a wide supply range (1.14 V to 2.625 V) and an operating temperature span of −40 °C to 100 °C, providing a compact, reconfigurable logic solution for designs that require high logic density and robust thermal performance.

Key Features

• Core Logic  86,184 logic elements provide substantial capacity for complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
• I/O  180 user I/O pins to accommodate multiple interfaces and peripheral connections without extensive external glue logic.
• Power Flexibility  Operates across a wide supply voltage range from 1.14 V to 2.625 V to match varied system power domains.
• Package & Mounting  Delivered in a 325-TFBGA / 325-FCBGA (11×11) surface-mount package for compact board-level integration.
• Industrial Temperature Range  Guaranteed operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliant  Meets RoHS requirements for lead-free assembly and regulatory compliance in many regions.

Typical Applications

• Industrial Control  Programmable logic for automation, motion control, and PLC subsystems where industrial temperature and reliability are required.
• Embedded Systems  On-chip logic and memory for custom data processing, protocol handling, and glue-logic consolidation in compact designs.
• I/O-Intensive Interfaces  High pin-count I/O for aggregating sensors, actuators, and peripheral interfaces without large external device counts.
• Space-Constrained Designs  High logic density in a 325-FCBGA package for applications that require reduced PCB area and low-profile components.

Unique Advantages

• High Logic Density: 86,184 logic elements enable implementation of complex state machines, custom datapaths, and peripheral controllers on a single device.
• Significant On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup tables.
• Generous I/O Count: 180 user I/O simplifies system integration and reduces the need for additional interface chips.
• Wide Supply Range: Operation from 1.14 V to 2.625 V supports integration into a variety of system power architectures.
• Industrial Temperature Support: Rated for −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact Surface-Mount Package: 325-FCBGA (11×11) provides a small footprint solution for space-sensitive board layouts.

Why Choose M2GL090TS-FCSG325I?

The M2GL090TS-FCSG325I delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 325-FCBGA package designed for industrial operating conditions. Its wide voltage range and extended temperature rating make it suitable for engineers who need a reconfigurable logic device that fits into constrained board space while meeting robust environmental requirements.

This device is well suited to development teams and procurement groups targeting industrial and embedded applications that demand substantial on-chip resources, flexible I/O, and a compact form factor for long-term, reliable deployment.

Request a quote or submit a purchase inquiry to evaluate the M2GL090TS-FCSG325I for your next design.