M2GL090TS-1FGG676T2

The M2GL090TS-1FGG676T2 is a Microchip IGLOO2 family field programmable gate array (FPGA) delivered in a 676‑BGA package. It combines flash‑based FPGA fabric and embedded system resources to address applications that require high logic density, extensive I/O and robust on‑chip memory.

Designed for demanding environments, this device provides 86,316 logic elements, approximately 2.65 Mbits of embedded RAM, up to 425 user I/Os and automotive AEC‑Q100 qualification, making it suitable for high‑reliability communication, signal processing and embedded control systems.

Key Features

• Core Architecture 
  IGLOO2 flash‑based FPGA fabric with 4‑input LUTs and carry chains (family architecture information from product brief).
• Logic Capacity 
  86,316 logic elements to implement complex custom logic and control functions.
• Embedded Memory 
  Approximately 2.65 Mbits (2,648,064 bits) of on‑chip RAM to support buffers, state storage and local data processing.
• I/O and High‑Speed SerDes 
  Up to 425 user I/Os and family‑level support for high‑speed SERDES lanes and protocols such as PCIe and XAUI/XGMII (per IGLOO2 product brief).
• High‑Speed Memory Interfaces 
  Family features include DDRx memory controller support (LPDDR/DDR2/DDR3), enabling high‑bandwidth external memory interfacing where required.
• Package and Mounting 
  676‑BGA (676‑FBGA, 27 × 27 mm) surface mount package for compact system integration.
• Voltage and Power 
  Accepted supply range from 1.14 V to 2.625 V to accommodate various I/O and core power schemes.
• Operating Range and Qualification 
  Rated for −40 °C to 125 °C operation and AEC‑Q100 qualification (automotive grade).
• System Integration 
  Family product brief documents advanced subsystems such as HPMS peripherals, DMA controllers and embedded nonvolatile memory options for integrated system designs.
• Regulatory 
  RoHS compliant.

Typical Applications

• Automotive Control Systems 
  AEC‑Q100 qualification and −40 °C to 125 °C temperature range make this FPGA suitable for automotive embedded control, domain controllers and safety‑related subsystems.
• High‑Speed Communications 
  Large I/O count and family support for SERDES lanes, PCIe and XAUI enable implementation of Ethernet, PCIe endpoints and other high‑speed interfaces.
• Signal Processing and DSP 
  Significant logic capacity and embedded RAM support DSP pipelines, filtering and math‑intensive functions referenced in the IGLOO2 family brief.
• Embedded Memory‑Intensive Systems 
  On‑chip RAM plus DDRx controller support provide the bandwidth and local storage needed for buffering, frame processing and data logging.

Unique Advantages

• High Logic Density: 86,316 logic elements allow consolidation of multiple functions into a single device, reducing component count.
• Substantial On‑Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage tasks.
• Automotive Qualification: AEC‑Q100 qualification and extended temperature operation support integration into automotive and other harsh‑environment systems.
• Broad I/O and Interface Flexibility: Up to 425 user I/Os and family‑level high‑speed interface support enable versatile protocol and peripheral implementations.
• Compact, Surface‑Mount Package: 676‑BGA (27 × 27 mm) package enables high‑density board layouts while supporting the device’s pin count and thermal needs.
• Wide Supply Range: 1.14 V to 2.625 V supply window accommodates a range of core and I/O voltage configurations.

Why Choose M2GL090TS-1FGG676T2?

The M2GL090TS‑1FGG676T2 delivers a high‑capacity IGLOO2 FPGA configuration that balances substantial logic and on‑chip memory with extensive I/O and automotive qualification. Its combination of 86,316 logic elements, roughly 2.65 Mbits of embedded RAM and support for high‑speed interfaces positions it for systems that demand integrated control, data movement and signal processing.

This device is well suited to engineers developing automotive electronics, communication endpoints and embedded systems that require a qualified, high‑density programmable logic solution with flexible power and packaging options. The IGLOO2 family architecture details further support integrated subsystem implementation where on‑chip peripherals and memory controllers are required.

Request a quote or submit an inquiry for pricing and availability to begin evaluating the M2GL090TS-1FGG676T2 for your next design.