M2GL090TS-1FGG676

The M2GL090TS-1FGG676 is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology designed for commercial-grade embedded designs. It integrates a high logic element count and substantial on-chip memory with a high I/O count in a compact 676-ball BGA package.

This device is suited to applications that require dense digital logic, significant embedded memory, and many external interfaces while operating within a standard commercial temperature range.

Key Features

• Core Logic 86,184 logic elements provide a high level of gate density for complex digital designs.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Capacity 425 user I/Os to support multiple external interfaces and high-pin-count designs.
• Power and Supply Wide voltage supply range from 1.14 V to 2.625 V to accommodate different core and I/O power architectures.
• Package and Mounting 676-BGA package (supplier device package: 676-FBGA, 27 × 27) with surface-mount mounting for compact board-level integration.
• Operating Range Rated for commercial operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Commercial Embedded Systems — Implement custom digital logic and control functions where commercial-grade components are required.
• High-Density I/O Interfaces — Use the device’s 425 I/O pins to aggregate or translate multiple signals and peripherals on a single FPGA.
• On-Chip Data Buffering — Leverage approximately 2.65 Mbits of embedded RAM for local buffering, state machines, and temporary data storage.

Unique Advantages

• High Logic Density: 86,184 logic elements enable complex and feature-rich digital designs without external gate arrays.
• Ample Embedded Memory: Approximately 2.65 Mbits of on-chip RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O Count: 425 user I/Os simplify system integration by supporting numerous external interfaces directly from the FPGA.
• Flexible Power Range: Support for 1.14 V to 2.625 V supply voltages offers adaptability to different power architectures.
• Compact BGA Footprint: 676-ball FBGA (27 × 27) package provides a high-density pinout in a space-efficient surface-mount form factor.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.

Why Choose M2GL090TS-1FGG676?

The M2GL090TS-1FGG676 brings together a large logic element count, significant embedded RAM, and a high number of I/Os in a compact 676-BGA package, making it an effective choice for commercial embedded designs that need dense digital capability and extensive external interfacing. As a Microchip Technology IGLOO2 FPGA, it offers a clear specification set for engineers specifying FPGAs into systems constrained by board space and commercial operating conditions.

Designers seeking scalability and integration for complex logic, on-chip buffering, and multi-signal I/O consolidation will find this device aligns with requirements for commercial applications where those specific hardware attributes are required.

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