M2GL090TS-FCS325I

The M2GL090TS-FCS325I is an IGLOO2 family Field Programmable Gate Array from Microchip Technology. It provides a mid-range programmable fabric with 86,184 logic elements, approximately 2.65 Mbits of embedded memory, and 180 user I/O pins in a 325-TFBGA (11×11) surface-mount package.

Built to operate across an industrial temperature range and a wide supply voltage window, this device addresses applications that require configurable logic density, on-chip memory, and robust operating conditions.

Key Features

• Logic Capacity 86,184 logic elements provide substantial programmable resources for implementing combinational and sequential logic, state machines, and custom peripherals.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM for buffering, lookup tables, and data storage without external memory.
• I/O Count 180 user I/O pins to support multiple interfaces and signal routing directly from the package.
• Power Wide supply voltage range from 1.14 V to 2.625 V to accommodate varied power-domain designs and interfacing requirements.
• Package & Mounting 325-TFBGA (11×11) FCBGA supplier package in a surface-mount form factor for high-density board assembly.
• Temperature & Grade Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environmental conditions.
• Regulatory Compliance RoHS-compliant construction for conformity with common environmental requirements.

Unique Advantages

• High programmable density: 86,184 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
• On-chip memory resources: Approximately 2.65 Mbits of embedded RAM minimizes reliance on external memory components for buffering and local storage.
• Flexible power domain support: The 1.14 V to 2.625 V supply range supports diverse voltage architectures and simplifies integration with different I/O standards.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in environments with wide temperature swings.
• Compact, manufacturable package: 325-TFBGA surface-mount package delivers high pin density in a space-efficient footprint for automated assembly.
• Environmentally compliant: RoHS compliance supports regulatory and sustainability objectives.

Why Choose M2GL090TS-FCS325I?

The M2GL090TS-FCS325I balances substantial logic capacity, embedded memory, and a high I/O count within a compact 325-TFBGA package, making it well suited for embedded designs that need configurable hardware resources and robust operating conditions. Its wide supply voltage range and industrial temperature rating provide design flexibility across multiple power and environmental requirements.

Backed by Microchip Technology's IGLOO2 family pedigree, this device offers a scalable platform for engineers seeking to integrate programmable logic, on-chip RAM, and a high number of I/Os while maintaining compliance with RoHS directives.

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