M2GL090TS-1FCSG325I

The M2GL090TS-1FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC supplied in a 325-TFBGA (11×11) package. It provides a high-density programmable fabric with 86,184 logic elements and embedded memory to support complex digital designs.

With up to 180 I/O, an embedded memory complement of approximately 2.65 Mbits, a wide supply range (1.14 V to 2.625 V) and industrial-grade operating temperature, this device is targeted at applications that require significant on-chip logic, compact packaging and extended temperature operation.

Key Features

• Core Logic — 86,184 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory — Approximately 2.65 Mbits of on-chip RAM to support buffering, state machines and local data storage.
• I/O Capacity — Up to 180 general-purpose I/O pins for interfacing to external devices and subsystems.
• Power Supply Range — Operates across a 1.14 V to 2.625 V supply range to support a variety of low-voltage system architectures.
• Package & Mounting — 325-TFBGA (325-FCBGA, 11×11) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade — Industrial grade with an operating temperature range of −40°C to 100°C for extended-environment designs.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital logic designs — Use the device where up to 86,184 logic elements are required for custom processing, protocol handling or state-machine implementations.
• On-chip memory-dependent functions — Suitable for designs that need approximately 2.65 Mbits of embedded RAM for buffering, packet processing or temporary storage.
• Multi-I/O interfacing — Ideal for systems requiring up to 180 I/O pins to connect sensors, actuators, or external peripherals in a compact package.

Unique Advantages

• High logic density: 86,184 logic elements enable consolidation of multiple functions into a single IC, reducing overall BOM.
• Significant on-chip memory: Approximately 2.65 Mbits of RAM minimizes external memory dependence and lowers board complexity.
• Flexible I/O count: 180 I/O pins provide broad interfacing options for mixed-signal and multi-peripheral systems.
• Wide supply compatibility: 1.14 V to 2.625 V operation supports integration into a range of low-voltage system architectures.
• Industrial temperature capability: Rated from −40°C to 100°C for deployment in environments requiring extended temperature range.
• Compact surface-mount package: 325-TFBGA (11×11) format enables high-density board layouts and smaller system footprints.

Why Choose M2GL090TS-1FCSG325I?

The M2GL090TS-1FCSG325I positions itself as a compact, industrial-grade FPGA option delivering substantial logic capacity, embedded memory and I/O flexibility in a 325-TFBGA surface-mount package. Its electrical and thermal specifications make it appropriate for designs that need significant on-chip resources while maintaining a small board footprint.

This device is well suited for engineering teams looking to consolidate functionality, reduce external components and deploy solutions across extended temperature ranges, while maintaining compliance with RoHS requirements.

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