M2GL090TS-1FCS325I

The M2GL090TS-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) in a 325-ball TFBGA/FCBGA package. It provides a mid-range programmable-logic resource set with a balance of logic capacity, embedded memory, and I/O for industrial applications.

With an operating temperature range of -40°C to 100°C and an industrial grade designation, this FPGA targets designs that require reliable operation across extended temperatures while offering flexible on-chip resources and a compact surface-mount package footprint.

Key Features

• Core Architecture  IGLOO2 Field Programmable Gate Array (FPGA) architecture implemented in this device.
• Logic Capacity  86,184 logic elements provide substantial programmable logic resources for mid-range designs.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM to support data buffering, state machines, and local memory needs.
• I/O Count  180 user I/Os to support multiple peripheral interfaces and board-level connectivity.
• Power and Voltage Range  Supports a system voltage range from 1.14 V to 2.625 V to accommodate a variety of power architectures.
• Package & Mounting  325-TFBGA / 325-FCBGA surface-mount package (supplier device package: 325-FCBGA, 11×11) for compact PCB integration.
• Environmental & Reliability  Industrial grade device with an operating temperature range of -40°C to 100°C and RoHS compliance.

Typical Applications

• Industrial control  Use the FPGA for control logic, sensor interfacing, and I/O aggregation where industrial temperature performance is required.
• Embedded systems  Implement custom processing blocks and peripheral interfaces leveraging 86,184 logic elements and embedded RAM.
• Communications and protocol bridging  Deploy the device to handle protocol conversion, buffering, and glue logic across multiple I/O lines.

Unique Advantages

• Substantial logic resources: 86,184 logic elements enable complex, custom logic implementations without external PLD or ASIC dependence.
• On-chip memory capacity: Approximately 2.65 Mbits of embedded RAM supports local buffering and state retention, reducing external memory requirements.
• Broad I/O availability: 180 I/Os permit extensive peripheral connectivity and flexible board-level interfacing.
• Industrial temperature rating: Rated for -40°C to 100°C operation to meet temperature demands in rugged or factory-floor environments.
• Compact surface-mount package: 325-ball FCBGA/TFBGA (11×11) minimizes PCB area while supporting high-density system integration.
• Flexible power input: Wide supply range from 1.14 V to 2.625 V for compatibility with diverse power architectures.

Why Choose M2GL090TS-1FCS325I?

The M2GL090TS-1FCS325I delivers a balanced combination of logic density, embedded memory, and I/O count in a compact surface-mount package with industrial temperature capability. It is well suited for engineers and teams building mid-range programmable-logic solutions that demand reliable operation across extended temperature ranges and a reduced need for external memory or I/O expansion.

Backed by manufacturer documentation, this IGLOO2 FPGA offers a practical platform for scalable designs where integration, robustness, and clear resource sizing are priorities.

Request a quote or submit a request to receive pricing and availability details for the M2GL090TS-1FCS325I. Our team can help evaluate fit for your design and provide next steps for procurement.