M2GL090TS-1FCSG325

IC FPGA 180 I/O 324CSBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 180 2648064 86184 325-TFBGA, FCBGA

Quantity 210 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package325-FCBGA (11x11)GradeCommercialOperating Temperature0°C – 85°C
Package / Case325-TFBGA, FCBGANumber of I/O180Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs86184Number of Logic Elements/Cells86184
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2648064

Overview of M2GL090TS-1FCSG325 – IGLOO2 Field Programmable Gate Array, 86,184 logic elements, 325-TFBGA

The M2GL090TS-1FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, packaged in a 325-TFBGA (11×11) surface-mount package. It provides a combination of 86,184 logic elements, approximately 2.65 Mbits of embedded memory, and 180 I/O pins for mid- to high-density programmable logic implementations.

Designed for commercial-grade electronic designs, the device operates from a 1.14 V to 2.625 V supply range and is specified for an operating temperature range of 0 °C to 85 °C. The M2GL090TS-1FCSG325 is RoHS compliant.

Key Features

  • Core Logic 86,184 logic elements suitable for complex combinational and sequential logic implementations.
  • Embedded Memory Approximately 2.65 Mbits of on-chip RAM for data buffering, FIFOs, and on-chip storage.
  • I/O Capacity 180 user I/Os to support multiple peripheral interfaces and board-level connectivity.
  • Supply Voltage Range Flexible power operation from 1.14 V to 2.625 V to match a variety of system voltage domains.
  • Package & Mounting 325-TFBGA (325-FCBGA, 11×11) package in a surface-mount form factor for compact board integration.
  • Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
  • Regulatory Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High logic density: 86,184 logic elements enable integration of substantial custom logic and control functions on a single device, reducing external component count.
  • Integrated on-chip memory: Approximately 2.65 Mbits of embedded RAM provides local storage for data buffering and state retention without external memory.
  • Generous I/O complement: 180 I/Os allow flexible interfacing to sensors, peripherals, and system buses, simplifying board-level routing and design.
  • Wide supply compatibility: 1.14 V to 2.625 V supply range supports diverse system power architectures and domain partitioning.
  • Compact, surface-mount packaging: 325-TFBGA (11×11) packaging supports high-density board layouts while maintaining robust solderable mounting.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial applications and environments.

Why Choose M2GL090TS-1FCSG325?

The M2GL090TS-1FCSG325 positions itself as a commercially rated IGLOO2 FPGA option for designs that require substantial on-chip logic, embedded memory, and a sizable I/O count in a compact BGA package. Its combination of 86,184 logic elements, approximately 2.65 Mbits of RAM, and 180 I/Os makes it suitable for applications that need integrated programmable logic and local data storage while maintaining a surface-mount, board-friendly footprint.

With a broad supply voltage window and RoHS compliance, this device offers design flexibility and manufacturability for development and production environments where commercial temperature operation is sufficient.

If you would like pricing, availability, or a formal quote for the M2GL090TS-1FCSG325, please request a quote or submit a procurement inquiry. Our team will provide the details you need to evaluate and source this FPGA for your design.

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