M2GL090T-FGG676I

The M2GL090T-FGG676I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides substantial on-chip logic capacity and embedded memory in a high-pin-count BGA package for programmable logic applications.

Designed for surface-mount board assemblies, this industrial-grade device combines 86,184 logic elements, approximately 2.648 Mbits of embedded memory, and 425 I/O pins with a broad supply-voltage range and an industrial operating temperature window.

Key Features

• Core / Logic 86,184 logic elements deliver on-chip programmable logic capacity for complex designs.
• Embedded Memory Approximately 2.648 Mbits of total on-chip RAM for data buffering, state storage, and lookup tables.
• I/O 425 I/O pins provide extensive connectivity for high-density peripheral and board-level interfacing.
• Power Supports a supply-voltage range from 1.14 V to 2.625 V to accommodate varying power architectures.
• Package & Mounting 676-FBGA (27×27) supplier package, 676-BGA case type, designed for surface-mount PCB assembly.
• Temperature & Grade Industrial-grade device rated for operation from –40°C to 100°C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control The industrial-grade temperature rating and broad supply-voltage range make this FPGA suitable for control and automation systems.
• High‑Density I/O Systems With 425 I/O pins, the device supports designs requiring extensive sensor, actuator, or peripheral interfaces.
• Memory‑Intensive Logic Approximately 2.648 Mbits of embedded RAM supports buffering, packet processing, and intermediate data storage inside the FPGA fabric.
• Compact, High‑Pin‑Count Board Designs The 676-FBGA (27×27) package provides a high pin count in a compact surface-mount form factor for dense PCB layouts.

Unique Advantages

• High Logic Capacity: 86,184 logic elements provide substantial on-chip programmable logic for complex functions without immediate external logic.
• Significant On‑Chip Memory: Approximately 2.648 Mbits of embedded RAM enables local storage for state machines, FIFOs, and data processing tasks.
• Extensive Connectivity: 425 I/O pins offer flexibility for multiple interfaces and parallel connections across a single device.
• Flexible Power Range: A wide supply-voltage window (1.14 V to 2.625 V) supports varied system power architectures.
• Industrial Operating Range: Rated for –40°C to 100°C operation to meet industrial environmental requirements.
• Surface‑Mount High‑Density Package: 676-FBGA (27×27) package enables high-pin-count implementations in a compact footprint.

Why Choose M2GL090T-FGG676I?

The M2GL090T-FGG676I positions itself as a highly capable IGLOO2 FPGA option for designers needing a balance of on-chip logic, embedded memory, and extensive I/O in an industrial-grade device. Its combination of 86,184 logic elements, approximately 2.648 Mbits of RAM, and 425 I/Os in a 676-FBGA package supports complex, high-density board designs.

Manufactured by Microchip Technology, this device is suitable for projects that require robust operation across a wide temperature range and flexible supply-voltage options. Its specification profile supports scalable designs where consolidated programmable logic, embedded memory, and high I/O count are key selection criteria.

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