M2GL090T-FG676I

The M2GL090T-FG676I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology. It delivers a high logic density device in a 676-FBGA (27×27) package with a broad I/O complement and on-chip memory for implementation of custom digital logic.

With 86,184 logic elements, approximately 2.65 Mbits of embedded memory, 425 I/Os, industrial-grade temperature capability, and a wide supply range, this device is positioned for applications that require substantial on-chip logic, numerous I/O connections, and reliable operation across extended temperature ranges.

Key Features

• Core / Logic 86,184 logic elements for implementing combinational and sequential logic, state machines, and custom accelerators.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM to support buffers, FIFOs, and intermediate data storage without external memory.
• I/O Density 425 user I/Os to support high channel counts, parallel interfaces, and complex board-level connectivity.
• Power Supply Operates across a wide voltage supply range from 1.14 V to 2.625 V to accommodate various core and I/O voltage domains.
• Package 676-FBGA (27×27) surface-mount package for compact board integration and high pin count routing.
• Temperature & Grade Industrial grade device rated for operation from -40°C to 100°C, suitable for extended-temperature environments.
• Regulatory Compliance RoHS-compliant construction.

Typical Applications

• Industrial Control — Suited for control systems and automation equipment that require many I/Os and reliable operation across industrial temperature ranges.
• Communications and Networking — Useful for interface aggregation, protocol bridging, and I/O-heavy datapath implementations leveraging high I/O count and on-chip RAM.
• Embedded Systems and Custom Logic — Ideal for designs that need substantial programmable logic and embedded memory to implement custom peripherals, state machines, or data handling functions.
• Test & Measurement — Supports high channel counts and custom digital front-end logic where on-chip resources and many I/Os are beneficial.

Unique Advantages

• High Logic Density: 86,184 logic elements enable complex custom logic implementations without immediate migration to larger discrete solutions.
• Substantial On‑Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for buffering and data staging.
• Extensive I/O Count: 425 I/Os provide flexibility for parallel interfaces, multi-channel I/O, and board-level integration.
• Wide Supply Flexibility: 1.14 V to 2.625 V operation accommodates a variety of core and I/O voltage domains on mixed-voltage designs.
• Industrial Temperature Rating: −40°C to 100°C rating supports deployment in extended-temperature environments.
• Compact High-Pin Package: 676-FBGA (27×27) package balances high pin count with space-efficient board footprint.

Why Choose M2GL090T-FG676I?

The M2GL090T-FG676I provides a balanced combination of logic capacity, embedded memory, and extensive I/O in a compact 676-FBGA package. Its industrial temperature rating and wide supply voltage range make it suitable for designs that must operate reliably across extended environmental conditions while integrating significant on-chip resources.

This FPGA is well suited to developers and system designers building industrial, communications, and embedded applications that need high I/O density and substantial programmable logic with on‑chip memory. As a Microchip Technology IGLOO2 device, it offers a defined set of resources for scalable custom-logic implementations.

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