M2GL090T-FG676

IC FPGA 425 I/O 676FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86316 676-BGA

Quantity 1,066 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O425Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs86184Number of Logic Elements/Cells86316
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2648064

Overview of M2GL090T-FG676 – IGLOO2 Field Programmable Gate Array (FPGA) IC

The M2GL090T-FG676 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a programmable logic fabric with a high logic-element count and substantial on-chip memory within a compact 676-ball FBGA package.

Targeted for commercial-grade embedded designs, the device delivers approximately 86,316 logic elements, roughly 2.65 Mbits of embedded memory, and up to 425 I/O pins, offering a balance of logic density, on-chip RAM and I/O capability for medium- to high-complexity implementations.

Key Features

  • Programmable Logic  Approximately 86,316 logic elements for implementing custom logic, state machines, and glue-logic functions.
  • Embedded Memory  Approximately 2.65 Mbits of on-chip RAM to support FIFOs, buffers, and small on-chip data storage needs.
  • I/O Capacity  Up to 425 I/O pins, enabling broad peripheral and interface connectivity within a single device.
  • Power  Supports a voltage supply range from 1.14 V to 2.625 V to accommodate different IO and core power configurations.
  • Package & Mounting  676-ball FBGA (27 × 27) in a 676-BGA package case, designed for surface-mount assembly to save PCB area.
  • Operating Conditions  Commercial-grade operating temperature range from 0 °C to 85 °C suitable for standard commercial applications.
  • Compliance  RoHS-compliant construction for regulatory and environmental conformity.

Unique Advantages

  • High logic density: The device’s ~86k logic elements let you implement complex logic and integration within a single FPGA, reducing external components.
  • Significant on-chip RAM: Approximately 2.65 Mbits of embedded memory supports buffering and data handling without relying solely on external memory.
  • Large I/O complement: 425 I/O pins provide headroom for multiple interfaces and peripheral connections, simplifying system-level routing.
  • Compact BGA package: The 676-FBGA (27×27) package enables a compact board footprint while delivering a large number of I/Os and ball connections.
  • Flexible power range: Wide supply voltage support from 1.14 V to 2.625 V allows integration into varied power architectures.
  • Commercial readiness: Commercial-grade temperature rating and RoHS compliance make it suitable for mainstream embedded product lines.

Why Choose M2GL090T-FG676?

The M2GL090T-FG676 positions itself as a capable commercial-grade FPGA that combines significant logic resources, appreciable embedded memory, and a high I/O count in a space-efficient 676-FBGA package. It is suited to designs that require consolidated programmable logic, on-chip buffering, and broad connectivity while keeping PCB area and component count under control.

With a defined supply voltage range and standard commercial operating temperature, this device offers a verifiable platform for developers and procurement teams seeking a reliable, RoHS-compliant FPGA for volume embedded applications.

If you would like pricing, availability, or a formal quote for the M2GL090T-FG676, submit a request or contact our sales team to start the procurement process.

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