M2GL090T-FG676
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86316 676-BGA |
|---|---|
| Quantity | 1,066 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 425 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86316 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090T-FG676 – IGLOO2 Field Programmable Gate Array (FPGA) IC
The M2GL090T-FG676 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a programmable logic fabric with a high logic-element count and substantial on-chip memory within a compact 676-ball FBGA package.
Targeted for commercial-grade embedded designs, the device delivers approximately 86,316 logic elements, roughly 2.65 Mbits of embedded memory, and up to 425 I/O pins, offering a balance of logic density, on-chip RAM and I/O capability for medium- to high-complexity implementations.
Key Features
- Programmable Logic Approximately 86,316 logic elements for implementing custom logic, state machines, and glue-logic functions.
- Embedded Memory Approximately 2.65 Mbits of on-chip RAM to support FIFOs, buffers, and small on-chip data storage needs.
- I/O Capacity Up to 425 I/O pins, enabling broad peripheral and interface connectivity within a single device.
- Power Supports a voltage supply range from 1.14 V to 2.625 V to accommodate different IO and core power configurations.
- Package & Mounting 676-ball FBGA (27 × 27) in a 676-BGA package case, designed for surface-mount assembly to save PCB area.
- Operating Conditions Commercial-grade operating temperature range from 0 °C to 85 °C suitable for standard commercial applications.
- Compliance RoHS-compliant construction for regulatory and environmental conformity.
Unique Advantages
- High logic density: The device’s ~86k logic elements let you implement complex logic and integration within a single FPGA, reducing external components.
- Significant on-chip RAM: Approximately 2.65 Mbits of embedded memory supports buffering and data handling without relying solely on external memory.
- Large I/O complement: 425 I/O pins provide headroom for multiple interfaces and peripheral connections, simplifying system-level routing.
- Compact BGA package: The 676-FBGA (27×27) package enables a compact board footprint while delivering a large number of I/Os and ball connections.
- Flexible power range: Wide supply voltage support from 1.14 V to 2.625 V allows integration into varied power architectures.
- Commercial readiness: Commercial-grade temperature rating and RoHS compliance make it suitable for mainstream embedded product lines.
Why Choose M2GL090T-FG676?
The M2GL090T-FG676 positions itself as a capable commercial-grade FPGA that combines significant logic resources, appreciable embedded memory, and a high I/O count in a space-efficient 676-FBGA package. It is suited to designs that require consolidated programmable logic, on-chip buffering, and broad connectivity while keeping PCB area and component count under control.
With a defined supply voltage range and standard commercial operating temperature, this device offers a verifiable platform for developers and procurement teams seeking a reliable, RoHS-compliant FPGA for volume embedded applications.
If you would like pricing, availability, or a formal quote for the M2GL090T-FG676, submit a request or contact our sales team to start the procurement process.

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