M2GL090T-FGG676
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86316 676-BGA |
|---|---|
| Quantity | 186 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 425 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86316 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090T-FGG676 – IGLOO2 Field Programmable Gate Array
The M2GL090T-FGG676 is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology. It provides a programmable logic platform with a substantial complement of logic elements, embedded memory, and a high count of general-purpose I/O in a compact BGA package.
This device integrates approximately 86,316 logic elements, approximately 2.65 Mbits of embedded memory, and 425 I/O connections in a 676-FBGA (27×27) surface-mount package. It is specified for commercial-grade applications with a supply voltage range of 1.14 V to 2.625 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Resources Approximately 86,316 logic elements provide flexible programmable logic density for complex designs.
- Embedded Memory Approximately 2.65 Mbits of on‑chip RAM to support buffering, state storage, and data processing functions.
- I/O Capacity 425 general-purpose I/O pins to support extensive external interfacing and parallel connectivity.
- Package & Mounting 676-BGA package (supplier device package: 676-FBGA, 27×27) designed for surface-mount assembly.
- Voltage Supply Operates from 1.14 V to 2.625 V to accommodate a variety of supply rail designs.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High programmable density: The device’s approximately 86,316 logic elements support complex custom logic implementations without external ASICs.
- Substantial on‑chip memory: Approximately 2.65 Mbits of embedded RAM reduce reliance on external memory for many buffering and data‑path needs.
- Extensive I/O count: 425 I/Os enable broad external connectivity for parallel interfaces, sensor arrays, or multi‑lane I/O requirements.
- Compact, manufacturable package: 676-FBGA (27×27) surface-mount package balances integration density with PCB footprint considerations.
- Flexible power operation: Wide supply range (1.14 V to 2.625 V) allows integration into varied power domains.
- Commercial readiness: Specified operating range of 0 °C to 85 °C and RoHS compliance for mainstream commercial deployments.
Why Choose M2GL090T-FGG676?
The M2GL090T-FGG676 delivers a balanced combination of programmable logic capacity, embedded memory, and high I/O count in a single commercial-grade FPGA from Microchip Technology. Its specified supply voltage range, surface-mount 676-FBGA packaging, and RoHS compliance make it suitable for a wide range of commercial electronic designs that require substantial on‑chip resources and dense external connectivity.
Designers and procurement teams seeking a Microchip IGLOO2 FPGA with defined logic, memory, and I/O capabilities will find this device a straightforward option for integrating programmable logic into their systems while meeting common commercial temperature and environmental requirements.
Request a quote or submit a procurement inquiry to get pricing and availability for the M2GL090T-FGG676.

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