M2GL090T-FGG676

IC FPGA 425 I/O 676FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86316 676-BGA

Quantity 186 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O425Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs86184Number of Logic Elements/Cells86316
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2648064

Overview of M2GL090T-FGG676 – IGLOO2 Field Programmable Gate Array

The M2GL090T-FGG676 is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology. It provides a programmable logic platform with a substantial complement of logic elements, embedded memory, and a high count of general-purpose I/O in a compact BGA package.

This device integrates approximately 86,316 logic elements, approximately 2.65 Mbits of embedded memory, and 425 I/O connections in a 676-FBGA (27×27) surface-mount package. It is specified for commercial-grade applications with a supply voltage range of 1.14 V to 2.625 V and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Resources  Approximately 86,316 logic elements provide flexible programmable logic density for complex designs.
  • Embedded Memory  Approximately 2.65 Mbits of on‑chip RAM to support buffering, state storage, and data processing functions.
  • I/O Capacity  425 general-purpose I/O pins to support extensive external interfacing and parallel connectivity.
  • Package & Mounting  676-BGA package (supplier device package: 676-FBGA, 27×27) designed for surface-mount assembly.
  • Voltage Supply  Operates from 1.14 V to 2.625 V to accommodate a variety of supply rail designs.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High programmable density: The device’s approximately 86,316 logic elements support complex custom logic implementations without external ASICs.
  • Substantial on‑chip memory: Approximately 2.65 Mbits of embedded RAM reduce reliance on external memory for many buffering and data‑path needs.
  • Extensive I/O count: 425 I/Os enable broad external connectivity for parallel interfaces, sensor arrays, or multi‑lane I/O requirements.
  • Compact, manufacturable package: 676-FBGA (27×27) surface-mount package balances integration density with PCB footprint considerations.
  • Flexible power operation: Wide supply range (1.14 V to 2.625 V) allows integration into varied power domains.
  • Commercial readiness: Specified operating range of 0 °C to 85 °C and RoHS compliance for mainstream commercial deployments.

Why Choose M2GL090T-FGG676?

The M2GL090T-FGG676 delivers a balanced combination of programmable logic capacity, embedded memory, and high I/O count in a single commercial-grade FPGA from Microchip Technology. Its specified supply voltage range, surface-mount 676-FBGA packaging, and RoHS compliance make it suitable for a wide range of commercial electronic designs that require substantial on‑chip resources and dense external connectivity.

Designers and procurement teams seeking a Microchip IGLOO2 FPGA with defined logic, memory, and I/O capabilities will find this device a straightforward option for integrating programmable logic into their systems while meeting common commercial temperature and environmental requirements.

Request a quote or submit a procurement inquiry to get pricing and availability for the M2GL090T-FGG676.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up