M2GL090T-FCSG325I

The M2GL090T-FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 86,184 logic elements, approximately 2.65 Mbits of embedded memory (2,648,064 bits), and 180 user I/O in a 325-ball TFBGA/FCBGA package.

Specified for industrial-grade operation, the device supports a supply voltage range of 1.14 V to 2.625 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs requiring reprogrammable logic with extended environmental tolerance.

Key Features

• Core Logic 86,184 logic elements provide a substantial programmable fabric for implementing custom logic and control functions.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM (2,648,064 bits) for state storage, buffering, and data manipulation without external memory in many use cases.
• I/O Capacity 180 user I/O pins support a wide range of interface and signal connectivity requirements.
• Power Supply Range Operates from 1.14 V to 2.625 V, allowing compatibility with varied system power domains and design choices.
• Package Options Available in a 325‑ball TFBGA/FCBGA package (supplier device package: 325‑FCBGA, 11×11) for compact, board-level integration.
• Industrial Temperature Rating Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments.
• Mounting & Compliance Surface-mount device with RoHS compliance for modern assembly processes and environmental standards.

Typical Applications

• Industrial automation and control — Implements customizable logic, I/O aggregation, and timing functions within industrial equipment operating across extended temperature ranges.
• Embedded system logic — Provides programmable glue logic, peripheral interfacing, and on-chip memory for embedded designs requiring flexible logic capacity.
• Compact, board-level designs — The 325-ball TFBGA/FCBGA package and surface-mount profile fit space-constrained PCBs where high logic density is needed.

Unique Advantages

• High logic density: 86,184 logic elements deliver significant programmable capacity for complex designs without external programmable devices.
• Substantial on-chip RAM: Approximately 2.65 Mbits of embedded memory reduces dependence on external memory components for many tasks.
• Broad I/O count: 180 user I/O pins enable integration with multiple peripherals and interfaces from a single device.
• Wide voltage compatibility: 1.14 V to 2.625 V supply range provides flexibility to align with various system power rails.
• Industrial rating: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsher environments.
• RoHS-compliant BGA packaging: 325‑TFBGA/FCBGA package supports compact system integration and standard surface-mount assembly.

Why Choose M2GL090T-FCSG325I?

The M2GL090T-FCSG325I positions itself as a robust, industrial-grade IGLOO2 FPGA option from Microchip Technology, delivering a balance of logic capacity, embedded memory, and I/O density in a compact BGA package. Its extended operating temperature range and RoHS compliance make it suitable for designs that require reliability across a range of environments.

Engineers and procurement teams selecting this device gain a configurable hardware building block with sizable on-chip resources and flexible power supply support, appropriate for embedded and industrial applications that need reprogrammable logic and consolidated I/O in a surface-mount form factor.

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