M2GL090T-FCS325I

The M2GL090T-FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology, offered in a 325-TFBGA surface-mount package. It delivers a high density of programmable logic and embedded memory in an industrial-grade device tailored for embedded and industrial applications.

With 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM and 180 I/O pins, this device supports complex logic implementations while operating across a wide voltage and temperature range for robust deployment.

Key Features

• Core Logic  86,184 logic elements provide substantial programmable fabric for implementing custom digital functions and moderate to large-scale logic designs.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM enable local buffering, state storage, and fast data paths without external memory.
• I/O Capacity  180 I/O pins support a variety of external interfaces and parallel connections for peripherals and sensors.
• Power  Supported supply range from 1.14 V to 2.625 V offers flexibility for different system power rails and low-power designs.
• Package & Mounting  Available in a 325-TFBGA (325-FCBGA, 11×11) surface-mount package for compact board-level integration.
• Industrial Grade & Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
• Environmental Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• Industrial Automation  Use the device’s industrial temperature rating, high logic density and abundant I/O for control, monitoring and interface tasks in factory and process systems.
• Embedded Systems  Integrate custom logic, local RAM resources and multiple I/O connections into compact embedded designs where space and reliability matter.
• Instrumentation & Test  Implement signal processing, data aggregation and custom timing functions using on-chip memory and programmable logic.
• Communications Equipment  Leverage the logic capacity and I/O count for protocol bridging, data formatting and interface adaptation in communication modules.

Unique Advantages

• High Logic Capacity: 86,184 logic elements enable implementation of complex state machines, parallel processing and custom datapaths on-chip.
• On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduce dependence on external memory, simplifying board design and improving latency.
• Broad I/O Count: 180 I/O pins provide flexibility for connecting multiple peripherals, sensors and interfaces without additional multiplexing hardware.
• Industrial Temperature Tolerance: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact Surface-Mount Package: The 325-TFBGA (325-FCBGA, 11×11) package supports high-density PCB layouts and space-constrained designs.
• Wide Supply Voltage Range: Operates from 1.14 V to 2.625 V to accommodate different system power architectures.

Why Choose M2GL090T-FCS325I?

The M2GL090T-FCS325I combines substantial programmable logic, embedded memory and a large I/O set in an industrial-grade FPGA package from Microchip Technology. Its temperature tolerance, supply flexibility and compact 325-TFBGA footprint make it well suited for embedded and industrial projects that require reliable, on-board programmable logic.

This device is appropriate for designers seeking a scalable IGLOO2 FPGA solution that balances logic capacity, local RAM and integration for mid-to-high complexity applications while maintaining industrial operating margins.

Request a quote or submit an inquiry to our sales team for pricing and availability of the M2GL090T-FCS325I.