M2GL090T-1FGG676

The M2GL090T-1FGG676 is an IGLOO2 field-programmable gate array (FPGA) from Microchip Technology. It combines a high logic element count with abundant I/O and embedded memory in a 676-ball BGA package, suitable for compact, programmable digital designs.

Targeted for commercial-grade embedded and digital logic applications, this device offers a balance of logic density, on-chip RAM and I/O capacity for systems that require flexible hardware configurability within a defined commercial temperature range.

Key Features

• Core Logic Approximately 86,316 logic elements for implementing custom digital functions and state machines.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM to support data buffering, FIFOs and small memory blocks.
• I/O Capacity 425 user I/O pins to accommodate multiple interfaces, sensor connections and external devices.
• Package & Mounting 676-ball FBGA (27 × 27 mm) surface-mount package for compact board integration.
• Supply Voltage Range Operates from 1.14 V to 2.625 V, enabling compatibility with a variety of core and I/O voltage domains.
• Operating Temperature Commercial grade operation from 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• Embedded Systems — Implement custom control logic, protocol bridging and peripheral interfaces where on-board programmability is required.
• Digital Signal Control — Use the FPGA's logic and on-chip RAM for deterministic signal processing, control loops and timing-critical logic.
• Interface & I/O Expansion — Leverage 425 I/O pins to aggregate and manage multiple sensors, buses and external devices on a single device.

Unique Advantages

• High Logic Density: Approximately 86k logic elements enable complex designs without multiple discrete components.
• Ample Embedded Memory: Around 2.65 Mbits of on-chip RAM reduces dependency on external memory for buffering and temporary storage.
• Large I/O Count: 425 I/O pins provide flexibility for multi-channel interfaces and expansive peripheral connectivity.
• Compact BGA Package: 676-FBGA (27 × 27 mm) preserves board space while delivering significant integration.
• Flexible Power Operation: Wide supply range (1.14 V–2.625 V) supports diverse power domain architectures.
• Commercial Grade: Designed for 0 °C to 85 °C operation and RoHS compliance for standard commercial applications.

Why Choose M2GL090T-1FGG676?

The M2GL090T-1FGG676 delivers a practical combination of logic density, embedded memory and high I/O count in a compact 676-ball FBGA package from Microchip Technology. Its specifications make it well-suited for engineers designing programmable digital systems that require on-chip resources and a sizable number of external interfaces within a commercial temperature envelope.

For designs that prioritize board-level integration, configurability and RoHS compliance, this IGLOO2 FPGA provides a balance of capacity and physical footprint to support mid- to high-complexity implementations.

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