M2GL090T-1FG676I

The M2GL090T-1FG676I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial embedded applications. It combines high logic capacity with substantial on‑chip memory and a large I/O complement in a compact 676‑FBGA (27×27) package.

Key attributes include 86,316 logic elements, approximately 2.65 Mbits of embedded memory, a 425‑pin I/O count, a wide supply voltage range and an industrial operating temperature range, providing a balanced platform for application‑specific digital logic and system integration.

Key Features

• Logic Capacity  86,316 logic elements for implementing complex custom logic, signal processing and control functions.
• Embedded Memory  Approximately 2.65 Mbits of total on‑chip RAM to support buffering, state machines and local data storage.
• I/O Resources  425 available I/O pins to accommodate a wide range of interfacing requirements and parallel connectivity.
• Power and Voltage  Operates across a supply range of 1.14 V to 2.625 V, allowing integration with varied power architectures.
• Package and Mounting  676‑FBGA (27×27) package, surface‑mountable for compact board-level designs.
• Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Standards Compliance  RoHS compliant, supporting regulatory and manufacturing requirements for lead‑free assembly.

Typical Applications

• Industrial Control  Custom logic, sensor interfacing and actuator control leveraging the industrial temperature rating and large I/O count.
• Communications and Networking  Protocol adaptation, packet processing and parallel interface aggregation using the FPGA’s logic density and on‑chip RAM.
• Embedded Processing and Acceleration  Offload and accelerate application‑specific functions with substantial logic resources and local memory.
• Test, Measurement and Instrumentation  Implement timing, data capture and real‑time processing functions using abundant I/O and on‑chip RAM.

Unique Advantages

• High logic density: 86,316 logic elements enable implementation of sophisticated digital designs without external glue logic.
• Substantial on‑chip memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for many buffering and state‑storage needs.
• Large I/O complement: 425 I/O pins simplify connectivity to sensors, peripherals and high‑pin‑count interfaces.
• Wide supply range: Operates from 1.14 V to 2.625 V to accommodate a variety of system power domains.
• Industrial temperature capability: Rated for −40 °C to 100 °C for reliable operation in harsher environments.
• Compact, surface‑mount package: 676‑FBGA (27×27) provides a high‑pin‑count solution in a space‑efficient form factor.

Why Choose M2GL090T-1FG676I?

The M2GL090T-1FG676I delivers a balanced combination of logic capacity, embedded memory and I/O density in an industrial‑grade FPGA package from Microchip Technology. Its electrical and thermal ratings, together with RoHS compliance and a compact 676‑FBGA footprint, make it well suited for designs that require robust operation and significant on‑chip resources.

This device is appropriate for engineers and teams implementing custom digital functions, protocol logic, interface bridging and on‑board acceleration where integration, reliability and board‑level density are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for the M2GL090T-1FG676I.