M2GL090T-1FGG484

The M2GL090T-1FGG484 is an IGLOO2 family FPGA in a 484‑ball BGA package that provides a high count of programmable logic resources and on‑chip memory for custom digital designs. It combines substantial logic capacity with a large number of I/O and a compact surface‑mount 484‑FPBGA (23×23) package.

This commercial‑grade FPGA targets designs that require reconfigurable logic, significant embedded RAM, and flexible I/O connectivity within a defined commercial temperature range and low‑voltage supply window.

Key Features

• Logic Capacity  Approximately 86,316 logic elements for implementing complex custom logic, state machines, and glue‑logic functions.
• Embedded Memory  Approximately 2.65 Mbits of on‑chip RAM to store frame buffers, FIFOs, lookup tables, and other application memory needs.
• I/O Count  267 user I/O pins to support multiple parallel interfaces, buses, and external peripherals.
• Power and Voltage  Operates from a broad supply range of 1.14 V to 2.625 V, allowing integration into low‑voltage system rails.
• Package and Mounting  484‑ball FPBGA (23×23) package in a surface‑mount form factor for compact PCB designs.
• Operating Range and Grade  Commercial grade device specified for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Custom digital logic  Implement glue logic, protocol bridges, and custom state machines using the device’s large logic element count and embedded RAM.
• I/O consolidation  Aggregate multiple parallel and serial interfaces or expand connectivity using the 267 available I/O pins.
• Embedded buffering and data handling  Use approximately 2.65 Mbits of on‑chip RAM for FIFOs, frame buffers, and intermediate data storage in streaming or packetized designs.
• Compact system designs  Integrate significant programmable logic into space‑constrained PCBs with the 484‑FPBGA surface‑mount package.

Unique Advantages

• High logic density: The device’s ~86,316 logic elements enable complex designs without external programmable logic, reducing board-level component count.
• Substantial embedded memory: Approximately 2.65 Mbits of RAM supports on‑chip buffering and reduces dependence on external memory devices.
• Extensive I/O resources: 267 I/O pins provide flexibility to interface with multiple peripherals and external systems directly.
• Compact package for dense layouts: 484‑FPBGA (23×23) surface‑mount package helps keep board area minimal while preserving routing density.
• Flexible supply compatibility: Support for 1.14 V to 2.625 V supply rails eases integration into a range of low‑voltage system architectures.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operating range and RoHS compliance for standard commercial deployments.

Why Choose M2GL090T-1FGG484?

The M2GL090T-1FGG484 combines a high logic element count, meaningful on‑chip RAM, and a large I/O complement in a compact 484‑FPBGA package, making it well suited to designs that require a balance of logic density, embedded memory, and connectivity. Its support for low‑voltage supply rails and surface‑mount packaging facilitates integration into modern PCBs where board space and power constraints are important.

This commercial‑grade IGLOO2 FPGA is aimed at engineers and procurement teams building reconfigurable digital systems that need scalable logic capacity, on‑chip buffering, and extensive I/O while maintaining RoHS compliance and standard commercial temperature operation.

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