M2GL090T-1FG484M
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86184 484-BGA |
|---|---|
| Quantity | 1,255 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86184 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 2648064 |
Overview of M2GL090T-1FG484M – IGLOO2 FPGA, Military‑Grade, 484‑BGA
The M2GL090T-1FG484M is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology, offered in a 484‑ball fine‑pitch BGA package. It delivers a substantial logic capacity and on‑chip memory in a military‑grade, MIL‑STD‑883 qualified device designed for designs that require extended temperature operation and high I/O density.
Key Features
- Core Logic — Provides 86,184 logic elements for implementing complex digital functions and custom logic.
- Embedded Memory — Approximately 2.648 Mbits of on‑chip RAM to support buffers, FIFOs, and intermediate data storage.
- I/O Density — 267 I/O pins to support multiple interfaces and parallel connections in compact systems.
- Power Range — Supported voltage supply range from 1.14 V to 2.625 V, enabling flexible power‑domain integration.
- Package and Mounting — 484‑BGA package (supplier package: 484‑FPBGA 23×23) with surface‑mount attachment for compact board layouts.
- Qualification and Grade — Military grade with MIL‑STD‑883 qualification for applications requiring rugged, tested components.
- Operating Temperature — Rated for −55 °C to 125 °C to meet wide temperature operational needs.
- RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances.
Typical Applications
- Military and Aerospace Systems — Suited for mission‑critical logic, control and signal‑processing tasks where MIL‑STD‑883 qualification and extended temperature range are required.
- Rugged Embedded Control — High I/O count and substantial logic resources support complex sensor interfacing, platform management, and control functions in demanding environments.
- Communications Infrastructure — On‑chip RAM and dense logic enable packet processing, protocol bridging, and custom interface implementation.
Unique Advantages
- High logic capacity: 86,184 logic elements provide the headroom for sophisticated custom logic and hardware acceleration.
- Compact, high‑density package: 484‑BGA (23×23 FPBGA) allows a small board footprint while delivering many I/O and logic resources.
- Wide temperature capability: −55 °C to 125 °C rating supports deployment in thermally challenging and outdoor environments.
- Military qualification: MIL‑STD‑883 qualification offers tested reliability for defense and airborne platforms.
- Flexible supply range: 1.14 V to 2.625 V supply range aids integration across different power architectures.
- Integrated on‑chip memory: Approximately 2.648 Mbits of RAM reduces external memory needs and simplifies board design.
Why Choose M2GL090T-1FG484M?
The M2GL090T-1FG484M positions itself as a robust, military‑grade FPGA option for designers who need large logic capacity, meaningful embedded memory, and a high I/O count in a compact BGA package. Its MIL‑STD‑883 qualification and wide operating temperature range make it suitable for demanding environments where reliability and longevity are priorities.
Chosen for applications that require a balance of integration, reliability, and electrical flexibility, this IGLOO2 FPGA is appropriate for engineers developing rugged embedded systems, defense electronics, and communication platforms that benefit from on‑chip memory and dense logic resources.
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