M2GL090T-1FCSG325I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 180 2648064 86184 325-TFBGA, FCBGA |
|---|---|
| Quantity | 260 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 180 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86184 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090T-1FCSG325I – IGLOO2 Field Programmable Gate Array (FPGA)
The M2GL090T-1FCSG325I is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology. It provides a high-density logic fabric with 86,184 logic elements and approximately 2.65 Mbits of embedded RAM for custom digital designs.
Designed for industrial-grade applications, this surface-mount device offers 180 user I/O pins, a compact 325-TFBGA (11×11) FCBGA package, and a wide operating voltage and temperature range to support robust, space-efficient system implementations.
Key Features
- Core Logic 86,184 logic elements suitable for medium-to-high complexity digital designs and custom hardware acceleration.
- On-chip Memory Approximately 2.65 Mbits of embedded RAM to support frame buffering, FIFOs, and state storage without external memory for many functions.
- I/O 180 user I/O pins for flexible interfacing with sensors, peripherals, and communication transceivers.
- Power Supports a supply voltage range of 1.14 V to 2.625 V to accommodate a variety of core and I/O voltage architectures.
- Package & Mounting 325-TFBGA (11×11) FCBGA package in a surface-mount form factor for compact board layouts and automated assembly.
- Temperature Range Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Industrial Control Implement motor control logic, deterministic I/O handling, and custom state machines within industrial environments using the device’s wide temperature range and abundant logic resources.
- Embedded Systems Integrate protocol bridging, peripheral aggregation, and real-time data processing leveraging the device’s logic density and on-chip RAM.
- Communication Interfaces Implement custom interface logic, timing-critical bridging, and I/O conditioning across the 180 available pins for board-level connectivity tasks.
Unique Advantages
- High logic capacity: 86,184 logic elements enable consolidation of multiple digital functions into a single FPGA, reducing board-level complexity.
- Significant embedded RAM: Approximately 2.65 Mbits of on-chip memory reduces dependence on external RAM for many buffering and buffering-heavy functions.
- Wide supply voltage support: 1.14 V to 2.625 V operation provides flexibility when integrating with diverse power rails and I/O domains.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging industrial environments.
- Compact surface-mount package: 325-TFBGA (11×11) FCBGA package enables dense PCB layouts while maintaining a high pin count.
- RoHS compliant: Meets common environmental manufacturing requirements for modern electronic assemblies.
Why Choose M2GL090T-1FCSG325I?
The M2GL090T-1FCSG325I positions itself as a compact, industrial-grade IGLOO2 FPGA option that balances substantial logic capacity and embedded memory with a high I/O count and a space-efficient FCBGA package. Its voltage range and temperature rating make it suitable for robust embedded and industrial designs that require on-board programmability and integration.
Backed by Microchip Technology as the manufacturer, this device is appropriate for engineering teams looking to consolidate digital functions, implement custom interfaces, and maintain operation across a wide set of environmental conditions while keeping board area minimized.
Request a quote or submit a product inquiry to learn about availability and pricing for the M2GL090T-1FCSG325I.

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