M2GL090T-1FCS325

The M2GL090T-1FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC designed for commercial‑grade programmable logic implementations. It combines a high logic element count with on‑chip embedded memory, flexible I/O and low‑voltage operation to support dense logic integration in surface‑mount 325‑TFBGA packaging.

Key Features

• Logic Capacity  Approximately 86,184 logic elements for implementing complex programmable logic and custom hardware functions.
• Embedded Memory  Approximately 2.65 Mbits of on‑chip RAM to support data buffering, state storage, and local memory requirements.
• I/O  180 general‑purpose I/O pins to support a wide range of external interfaces and signal connections.
• Power  Supports a wide voltage supply range from 1.14 V to 2.625 V to accommodate various low‑voltage system designs.
• Package  325‑TFBGA (supplier device package: 325‑FCBGA, 11×11) surface‑mount package suitable for compact board layouts.
• Operating Range & Grade  Commercial‑grade device rated for 0 °C to 85 °C ambient operation and RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Use as a programmable logic backbone where moderate environmental range and RoHS compliance are required.
• High‑Density Logic Integration  Implement custom accelerators, protocol handlers, or glue logic using the large pool of logic elements and embedded RAM.
• I/O‑Rich Interfaces  Drive multiple peripheral connections or interface buses leveraging the 180 available I/O pins.
• Low‑Voltage Designs  Deploy in systems that operate within a 1.14 V to 2.625 V supply window for power‑sensitive applications.

Unique Advantages

• High Logic Density: Large count of logic elements enables consolidation of multiple functions into a single device, reducing overall BOM.
• On‑Chip Memory: Approximately 2.65 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Flexible I/O Count: 180 I/O pins provide design flexibility for interfacing with sensors, controllers, and peripheral devices.
• Compact Surface‑Mount Package: 325‑TFBGA/325‑FCBGA (11×11) package enables space‑efficient board designs while supporting high pin density.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation for mainstream commercial product deployments.
• RoHS Compliant: Meets RoHS requirements for environmental and regulatory conformity.

Why Choose M2GL090T-1FCS325?

The M2GL090T-1FCS325 IGLOO2 FPGA is positioned for designers who need a commercially graded, high‑capacity programmable logic device with substantial on‑chip memory and a broad I/O complement. Its low‑voltage operation and compact 325‑TFBGA surface‑mount package make it suitable for space‑conscious, power‑sensitive commercial designs.

Choose this device when you require a scalable, integrated logic solution that balances density, memory, and I/O capability while maintaining RoHS compliance and commercial temperature support.

If you would like pricing or availability information for M2GL090T-1FCS325, request a quote or submit an inquiry to our sales team today.