M2GL090-FGG484

IC FPGA 267 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86316 484-BGA

Quantity 875 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O267Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs86184Number of Logic Elements/Cells86316
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2648064

Overview of M2GL090-FGG484 – IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86316 484-BGA

The M2GL090-FGG484 is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology designed for commercial embedded applications. It combines a high count of logic elements with substantial on-chip RAM and a large I/O complement to support complex digital designs within a compact BGA package.

Key attributes include 86,316 logic elements, approximately 2.65 Mbits of embedded memory, and 267 user I/O, together with a 484-ball FPBGA package and a commercial operating temperature range of 0°C to 85°C.

Key Features

  • Core Logic  86,316 logic elements provide capacity for implementing complex custom logic and state machines.
  • Embedded Memory  Approximately 2.65 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
  • I/O Capacity  267 user I/O pins to support multiple interfaces and parallel connections.
  • Power Supply Range  Operates from 1.14 V to 2.625 V to accommodate a range of system voltage domains.
  • Package & Mounting  484-ball FPBGA (23 × 23) surface-mount package for high-density board integration.
  • Temperature & Grade  Commercial grade operation from 0°C to 85°C for mainstream embedded systems.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic capacity: 86,316 logic elements enable implementation of significant custom logic without external PLD resources.
  • Substantial embedded RAM: Approximately 2.65 Mbits of on-chip memory reduces dependency on external memory for many buffering and data-storage needs.
  • Extensive I/O: 267 I/O pins allow multiple parallel interfaces and flexible pin assignments for system integration.
  • Compact, board-friendly package: 484-FPBGA (23×23) surface-mount package balances density and manufacturability for PCB assembly.
  • Flexible power domain support: Wide supply range (1.14 V–2.625 V) enables integration with different core and I/O voltage domains.
  • Commercial temperature range: Rated 0°C to 85°C for general-purpose embedded deployments.

Why Choose M2GL090-FGG484?

The M2GL090-FGG484 positions itself as a high-capacity IGLOO2 FPGA option for designers needing substantial logic, embedded memory, and a large I/O count in a single, compact package. Its combination of 86,316 logic elements, approximately 2.65 Mbits of on-chip RAM, and 267 I/O make it suitable for commercial embedded systems that require dense programmable logic and local memory resources.

Backed by Microchip Technology and supplied in a 484-FPBGA surface-mount package with RoHS compliance, this device delivers a clear specification set for procurement and design planning where commercial-grade temperature and flexible power rails are required.

Request a quote or submit an inquiry to receive pricing and availability information for the M2GL090-FGG484.

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