M2GL090-FGG484
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86316 484-BGA |
|---|---|
| Quantity | 875 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86316 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090-FGG484 – IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86316 484-BGA
The M2GL090-FGG484 is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology designed for commercial embedded applications. It combines a high count of logic elements with substantial on-chip RAM and a large I/O complement to support complex digital designs within a compact BGA package.
Key attributes include 86,316 logic elements, approximately 2.65 Mbits of embedded memory, and 267 user I/O, together with a 484-ball FPBGA package and a commercial operating temperature range of 0°C to 85°C.
Key Features
- Core Logic 86,316 logic elements provide capacity for implementing complex custom logic and state machines.
- Embedded Memory Approximately 2.65 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
- I/O Capacity 267 user I/O pins to support multiple interfaces and parallel connections.
- Power Supply Range Operates from 1.14 V to 2.625 V to accommodate a range of system voltage domains.
- Package & Mounting 484-ball FPBGA (23 × 23) surface-mount package for high-density board integration.
- Temperature & Grade Commercial grade operation from 0°C to 85°C for mainstream embedded systems.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 86,316 logic elements enable implementation of significant custom logic without external PLD resources.
- Substantial embedded RAM: Approximately 2.65 Mbits of on-chip memory reduces dependency on external memory for many buffering and data-storage needs.
- Extensive I/O: 267 I/O pins allow multiple parallel interfaces and flexible pin assignments for system integration.
- Compact, board-friendly package: 484-FPBGA (23×23) surface-mount package balances density and manufacturability for PCB assembly.
- Flexible power domain support: Wide supply range (1.14 V–2.625 V) enables integration with different core and I/O voltage domains.
- Commercial temperature range: Rated 0°C to 85°C for general-purpose embedded deployments.
Why Choose M2GL090-FGG484?
The M2GL090-FGG484 positions itself as a high-capacity IGLOO2 FPGA option for designers needing substantial logic, embedded memory, and a large I/O count in a single, compact package. Its combination of 86,316 logic elements, approximately 2.65 Mbits of on-chip RAM, and 267 I/O make it suitable for commercial embedded systems that require dense programmable logic and local memory resources.
Backed by Microchip Technology and supplied in a 484-FPBGA surface-mount package with RoHS compliance, this device delivers a clear specification set for procurement and design planning where commercial-grade temperature and flexible power rails are required.
Request a quote or submit an inquiry to receive pricing and availability information for the M2GL090-FGG484.

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