M2GL090-FG676

The M2GL090-FG676 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivered in a 676-FBGA (27×27) package for surface-mount assembly. This commercial-grade FPGA provides a high logic element count and substantial on-chip memory with a broad I/O complement for diverse programmable-logic needs.

With a voltage supply range of 1.14 V to 2.625 V and an operating temperature range of 0 °C to 85 °C, the device is specified for commercial applications that require significant logic density, embedded memory, and large I/O capacity while meeting RoHS compliance.

Key Features

• FPGA Core Field Programmable Gate Array architecture designed for user-configurable digital logic implementation.
• Logic Capacity 86,316 logic elements to implement complex combinational and sequential designs.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM to support buffering, state storage, and data processing functions.
• I/O Density 425 general-purpose I/O pins to support multiple parallel interfaces and high-pin-count system requirements.
• Power Supply Supports a voltage supply range from 1.14 V to 2.625 V for flexible interfacing and power-domain design.
• Package & Mounting 676-BGA package (supplier 676-FBGA, 27×27) with surface-mount mounting for compact PCB integration.
• Commercial Grade & Compliance Rated for 0 °C to 85 °C operating temperature and RoHS compliant for regulatory alignment in commercial products.

Typical Applications

• High-density I/O interfacing — Use the 425 I/O pins to implement parallel buses, multi‑lane interfaces, or extensive sensor and peripheral connectivity.
• Embedded buffering and data handling — Approximately 2.65 Mbits of on-chip RAM supports packet buffering, FIFOs, and local data storage for real-time processing.
• Custom digital logic — 86,316 logic elements enable implementation of custom controllers, protocol bridges, and application-specific accelerators.

Unique Advantages

• High logic density: 86,316 logic elements provide the capacity to consolidate multiple functions into a single device, reducing the need for external glue logic.
• Significant on-chip memory: Approximately 2.65 Mbits of embedded RAM minimizes external memory dependencies for many buffering and stateful tasks.
• Extensive I/O: 425 I/O pins allow flexible system partitioning and support for high-pin-count interfaces without additional multiplexing hardware.
• Flexible power envelope: Wide supply range (1.14 V–2.625 V) accommodates various I/O standards and power-domain designs.
• Compact surface-mount package: 676-FBGA (27×27) provides a high-pin-count solution in a compact footprint suitable for dense PCB layouts.
• Commercial readiness: Specified 0 °C to 85 °C operating range and RoHS compliance align with mainstream product design requirements.

Why Choose M2GL090-FG676?

The M2GL090-FG676 delivers a balance of high logic element count, substantial embedded memory, and very large I/O capacity in a compact 676-FBGA package. As a commercial-grade IGLOO2 FPGA from Microchip Technology, it is suitable for designs that require consolidated programmable logic, on-chip buffering, and broad interface support within the specified voltage and temperature ranges.

Engineers and procurement teams will find this device appropriate for projects aiming to reduce component count while maintaining flexibility for iterative development and integration into space-constrained PCBs. Its RoHS compliance and surface-mount form factor simplify manufacturing for commercial product lines.

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