M2GL090-FG676I

The M2GL090-FG676I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact 676-ball FBGA package targeted at industrial applications.

With 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM, and 425 I/O lines, this device is well suited for IO‑intensive and mid-density logic integration where industrial temperature capability and flexible supply voltage are required.

Key Features

• Core Logic 86,184 logic elements provide substantial programmable logic capacity for custom digital designs.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM enable local data buffering and state storage for complex logic functions.
• I/O Density 425 available I/O pins support high‑pin-count interfaces and multiple parallel connections to external devices.
• Power and Supply Range Supports a wide supply voltage range from 1.14 V to 2.625 V to accommodate varying core and I/O power architectures.
• Package and Mounting 676-ball FBGA package (676-BGA, 676-FBGA (27×27)) designed for surface-mount assembly to minimize board footprint.
• Industrial Temperature Rating Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance RoHS compliant to meet common electronic assembly environmental requirements.

Typical Applications

• Industrial Control and Automation Suitable for logic consolidation, custom control functions, and interface aggregation in industrial systems thanks to industrial temperature rating and significant logic resources.
• I/O-Intensive Interface Bridging High I/O count enables dense parallel connectivity and protocol bridging between multiple peripherals and subsystems.
• Embedded Logic and Custom Processing Large logic capacity and on-chip RAM support bespoke finite-state machines, custom datapaths, and dedicated accelerators.

Unique Advantages

• High Logic Capacity: 86,184 logic elements allow integration of substantial digital functions into a single device, reducing component count.
• Ample On‑Chip Memory: Approximately 2.65 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Extensive I/O: 425 I/O pins provide flexibility for complex interfacing and signal routing across multiple subsystems.
• Flexible Power Options: Broad supply range (1.14 V–2.625 V) supports a variety of power architectures and design choices.
• Industrial Reliability: Operational range from −40 °C to 100 °C and RoHS compliance align with industrial deployment requirements.
• Compact Surface-Mount Package: 676-FBGA (27×27) reduces PCB area while supporting high pin density for feature-rich designs.

Why Choose M2GL090-FG676I?

The M2GL090-FG676I combines substantial logic resources, significant embedded memory, and a high I/O count in a compact 676-ball FBGA package, making it a practical choice for industrial designs that require mid-density programmable logic and extensive interfacing. Its wide supply voltage range and −40 °C to 100 °C operating rating provide flexibility for varied power and environmental constraints.

This device is appropriate for engineers and procurement teams seeking a robust, RoHS-compliant FPGA option that consolidates logic, memory, and I/O in a single component to simplify board-level design and reduce overall BOM complexity.

Request a quote or submit an inquiry today to evaluate the M2GL090-FG676I for your next industrial or I/O‑intensive FPGA design.