M2GL090-FCSG325I

The M2GL090-FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides reprogrammable logic resources, embedded memory and a broad I/O count in a 325-FCBGA package targeted for industrial applications.

With 86,184 logic elements and approximately 2.65 Mbits of on-chip RAM, this device is suited to designs that require substantial embedded logic, moderate embedded memory and flexible I/O in a surface-mount BGA form factor.

Key Features

• Logic Capacity  86,184 logic elements provide the core reconfigurable fabric for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 2.65 Mbits of total on-chip RAM support data buffering, FIFOs and tightly coupled storage for implemented logic.
• I/O  180 user I/O pins accommodate multiple interfaces and peripheral connectivity in a single device footprint.
• Power Supply Range  Operates across a supply range of 1.14 V to 2.625 V to match target system voltage requirements.
• Package and Mounting  Supplied in a 325-FCBGA (11×11) package for surface-mount PCB assembly, balancing density and thermal path for board-level integration.
• Industrial Temperature Range  Specified for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Compliance  RoHS compliant to support regulatory and manufacturing needs.

Typical Applications

• Industrial Control  Implements custom control logic, protocol bridging and I/O aggregation where industrial temperature capability is required.
• Embedded Systems  Provides reconfigurable logic and on-chip RAM for embedded compute tasks, peripheral interfacing and system glue logic.
• Communications Equipment  Supports protocol adaptation and interface consolidation using the device's logic capacity and 180 I/O pins.
• Test & Measurement  Useful for FPGA-based signal processing frontend, data capture and custom instrument control leveraging embedded memory and I/O.

Unique Advantages

• High Logic Density: 86,184 logic elements enable implementation of complex custom logic and multiple concurrent functions in one device.
• Substantial On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduce external memory dependencies for many buffering and data-path needs.
• Generous I/O Count: 180 I/O pins provide flexibility to connect a wide range of peripherals and interfaces without additional multiplexing logic.
• Wide Supply Range: Operation from 1.14 V to 2.625 V allows integration into systems with different core-voltage domains.
• Industrial-Rated Operation: Specified −40 °C to 100 °C operation supports deployments in industrial environments.
• Compact BGA Package: The 325-FCBGA (11×11) package offers a compact footprint for board-level space optimization while supporting surface-mount assembly.

Why Choose M2GL090-FCSG325I?

The M2GL090-FCSG325I combines a large reprogrammable logic fabric, significant on-chip RAM and a high I/O count in a single industrial-grade FPGA package from Microchip Technology. Its voltage flexibility and industrial temperature rating make it suitable for embedded and industrial designs that require scalable logic capacity and robust operation.

This device is appropriate for engineers and procurement teams seeking a Microchip IGLOO2 FPGA with strong integration of logic, memory and I/O in a surface-mount 325-FCBGA package, providing long-term design stability and integration options for a range of system architectures.

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