M2GL090-1FGG676I

The M2GL090-1FGG676I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balanced combination of logic capacity, embedded memory, and a high I/O count in a compact ball-grid array package targeted at industrial embedded designs.

With 86,316 logic elements, approximately 2.65 Mbits of on-chip RAM and 425 I/Os, this device is suited for reconfigurable control, interface and signal-processing tasks where integration, I/O density and industrial temperature capability are important.

Key Features

• Logic Capacity Provides 86,316 logic elements to implement complex custom logic and control functions.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM for local buffering, FIFOs and small data-storage needs.
• High I/O Count 425 general-purpose I/O pins to support dense peripheral interfacing and multi-channel connectivity.
• Flexible Power Operates across a supply range of 1.14 V to 2.625 V to accommodate a variety of system power architectures.
• Package & Mounting Available in a 676-ball BGA (supplier package: 676-FBGA, 27×27) with surface-mount mounting for compact PCB layouts.
• Industrial Temperature Rating Rated for operation from −40 °C to 100 °C, suitable for deployment in industrial environments.
• RoHS Compliant Conforms to RoHS environmental requirements.

Typical Applications

• Industrial Control — Use for PLC logic, motor control interfaces and sensor aggregation where industrial temperature range and reprogrammability are required.
• Communications & Networking — Implement protocol bridging, port aggregation and custom interface logic leveraging the high I/O count and on-chip memory.
• Embedded Systems — Offload custom hardware functions, implement finite-state machines and accelerate deterministic tasks using the device’s logic resources and embedded RAM.
• Test & Measurement — Integrate custom signal handling, data capture and preprocessing capabilities into compact instrumentation designs.

Unique Advantages

• High Logic Density: 86,316 logic elements enable integration of complex functions into a single FPGA, reducing board count and system complexity.
• Significant On‑Chip Memory: Approximately 2.65 Mbits of embedded RAM supports buffering and local data storage without external memory.
• Large I/O Capacity: 425 I/Os simplify interfacing to multiple peripherals and sensors, minimizing external interface components.
• Industrial Reliability: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
• Flexible Power Options: Wide supply range (1.14 V–2.625 V) accommodates diverse system power rails and design choices.
• Compact BGA Footprint: 676-ball BGA (27×27) package enables dense designs where PCB space is limited.

Why Choose M2GL090-1FGG676I?

The M2GL090-1FGG676I delivers a combination of substantial logic resources, embedded memory and a high number of I/Os in a compact, surface-mount BGA package. Its industrial temperature rating and flexible supply range make it well suited to embedded and industrial applications that require reconfigurable logic and reliable operation across a wide environmental range.

Manufactured by Microchip Technology, this IGLOO2 FPGA is positioned for designers who need on-board integration of complex control, interfacing and buffering functions while maintaining a small PCB footprint and support for varied system power architectures.

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