M2GL090-1FGG484I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86316 484-BGA |
|---|---|
| Quantity | 755 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86316 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090-1FGG484I – IGLOO2 FPGA, 86,316 logic elements, 484-BGA
The M2GL090-1FGG484I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade, reconfigurable logic applications. It provides 86,316 logic elements, approximately 2.65 Mbits of embedded memory, and 267 I/O pins in a compact 484-FPBGA (23 × 23) surface-mount package.
With a supply voltage range of 1.14 V to 2.625 V and an operating temperature range of –40°C to 100°C, this device targets systems that require substantial on-chip logic and memory capacity while meeting industrial temperature and packaging constraints.
Key Features
- Logic Capacity — 86,316 logic elements to support complex, reconfigurable digital designs and custom logic implementations.
- Embedded Memory — Approximately 2.65 Mbits of on-chip RAM for data buffering, state storage, and application-specific memory needs.
- I/O Count — 267 user I/O pins to interface with peripherals, sensors, and external logic.
- Power Supply Range — Flexible supply requirements from 1.14 V to 2.625 V to accommodate a variety of system power architectures.
- Package and Mounting — 484-FPBGA (23 × 23) package, surface-mount mounting type, suitable for compact board designs.
- Industrial Grade — Specified operating range from –40°C to 100°C and RoHS compliance for industrial deployments.
Typical Applications
- Industrial Control — Use the FPGA’s logic density and industrial temperature rating to implement motor control, real-time sequencing, and factory automation logic.
- Embedded Systems — Integrate custom interfaces and preprocessing functions using the device’s abundant logic and on-chip memory to offload CPU tasks.
- Communications and Networking — Implement protocol handling, packet buffering, and custom I/O processing leveraging the large I/O count and embedded RAM.
- Instrumentation and Test Equipment — Utilize reconfigurable logic and memory for data acquisition, signal conditioning, and custom measurement algorithms.
Unique Advantages
- High Logic Density: 86,316 logic elements provide the capacity needed for complex custom logic without external gate arrays.
- Substantial On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Broad I/O Count: 267 I/O pins enable diverse peripheral connectivity and multiple interface implementations on a single device.
- Industrial Temperature Range: Rated for –40°C to 100°C to meet demanding environmental requirements in industrial applications.
- Compact, Surface-Mount Packaging: 484-FPBGA (23 × 23) format supports high-density board layouts while maintaining thermal and mechanical stability.
- RoHS Compliant: Environmentally compliant manufacturing status for regulatory alignment.
Why Choose M2GL090-1FGG484I?
The M2GL090-1FGG484I balances high logic capacity, meaningful embedded memory, and extensive I/O in a single industrial-grade FPGA package from Microchip Technology. Its electrical and thermal specifications make it suitable for designs that need substantial on-chip resources while operating across a wide temperature range.
This device is well suited to engineers developing industrial automation, embedded processing, communications, and instrumentation systems that require reconfigurable logic, integrated memory, and a high pin count in a compact BGA footprint.
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