M2GL090-1FG676I

The M2GL090-1FG676I is an IGLOO2 Field Programmable Gate Array (FPGA) IC designed for industrial applications. It integrates a high count of logic elements, substantial on-chip RAM, and a large I/O complement in a 676-ball FBGA package to support complex embedded and control designs.

With a wide supply voltage range and extended operating temperature, this device targets industrial systems that require dense logic integration, flexible I/O, and reliable operation across typical industrial environmental conditions.

Key Features

• Core Logic  86,316 logic elements provide programmable fabric for custom logic, state machines, and data-path implementations.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM to support buffering, FIFOs, and temporary data storage without external memory.
• I/O Capacity  425 device I/Os enable broad connectivity for sensors, buses, peripherals, and external interfaces in constrained board layouts.
• Power and Supply  Operates across a 1.14 V to 2.625 V supply range, allowing flexible power-domain integration in multi-voltage systems.
• Package and Mounting  676-ball FBGA (27 × 27 mm) surface-mount package offers a compact footprint with high pin density for complex routing.
• Temperature and Grade  Industrial-grade device rated for operation from −40°C to 100°C for deployment in industrial environments.
• Regulatory  RoHS compliant for restricted substances and environmental regulatory alignment.

Typical Applications

• Industrial Control  Implement custom control logic, motor drives, and automation interfaces using the device’s high logic density and wide I/O complement.
• Embedded Processing  Use on-chip RAM and logic elements for protocol handling, data aggregation, and preprocessing in embedded systems.
• Communications and Networking  Support multi-channel interfacing and custom packet processing with abundant I/Os and programmable fabric.
• Instrumentation and Test Equipment  Integrate signal sequencing, data capture, and real-time control functions within a compact surface-mount package.

Unique Advantages

• High Logic Density: 86,316 logic elements provide capacity for complex designs while reducing the need for multiple devices.
• Substantial On-Chip Memory: Approximately 2.65 Mbits of embedded RAM lowers external memory dependence and simplifies board design.
• Extensive I/O Availability: 425 I/Os enable rich peripheral and bus connectivity without additional multiplexing hardware.
• Industrial Temperature Capability: Rated −40°C to 100°C to maintain operation across harsh industrial environments.
• Compact High-Density Package: 676-FBGA (27 × 27 mm) supports dense routing and saves PCB area compared with multiple discrete components.
• Flexible Power Integration: Wide supply voltage range (1.14 V–2.625 V) facilitates integration into varied power architectures.

Why Choose M2GL090-1FG676I?

The M2GL090-1FG676I IGLOO2 FPGA balances high logic capacity, embedded memory, and a large I/O count in a compact 676-FBGA package tailored for industrial applications. Its wide supply voltage range and −40°C to 100°C operating window make it suitable for robust embedded designs that demand reliable operation and flexible board-level integration.

This device is well suited for engineers and teams implementing dense logic functions, multi-channel I/O systems, and embedded processing tasks who require an industrial-grade FPGA with on-chip memory and a compact form factor.

Request a quote or submit a request for pricing and availability for the M2GL090-1FG676I to begin design evaluation and procurement.