M2GL090-1FGG484

IC FPGA 267 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86316 484-BGA

Quantity 253 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O267Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs86184Number of Logic Elements/Cells86316
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2648064

Overview of M2GL090-1FGG484 – IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86316 484-BGA

The M2GL090-1FGG484 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology designed for programmable digital logic applications. It provides a high logic element count, substantial on-chip memory, and a large I/O complement in a compact BGA surface-mount package, making it suitable for designs that require dense logic integration and flexible I/O connectivity.

Key Features

  • Core Logic  86,316 logic elements for implementing complex digital designs and custom logic functions.
  • Embedded Memory  Approximately 2.65 Mbits of on-chip RAM (2,648,064 bits) to support buffering, state storage, and local data processing.
  • I/O Capacity  267 available I/O pins to accommodate multiple parallel interfaces and peripheral connections.
  • Power Supply Range  Wide operating supply voltage from 1.14 V to 2.625 V to support varied core and I/O voltage domains.
  • Package & Mounting  Surface-mount 484-BGA package; supplier device package listed as 484-FPBGA (23×23) for compact board-level integration.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C, and RoHS compliant for environmental conformity.

Typical Applications

  • Custom Digital Processing  Implement application-specific logic and data paths using the 86,316 logic elements and embedded RAM.
  • High-Density I/O Systems  Support systems requiring many external interfaces with up to 267 I/O pins.
  • Embedded System Integration  Integrate control, glue logic, and peripheral handling in a compact 484-BGA surface-mount package.

Unique Advantages

  • High Logic Density: 86,316 logic elements enable complex logic implementations without external gate arrays.
  • Significant On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
  • Large I/O Count: 267 I/O pins provide flexibility for multi-channel interfacing and parallel connectivity.
  • Flexible Power Support: Supply range from 1.14 V to 2.625 V accommodates a variety of voltage domains in mixed-signal systems.
  • Compact, Board-Ready Package: 484-BGA / 484-FPBGA (23×23) surface-mount package simplifies board layout for space-constrained designs.
  • RoHS Compliant: Conforms to environmental standards for lead-free assembly and regulatory compliance.

Why Choose M2GL090-1FGG484?

The M2GL090-1FGG484 delivers a combination of high logic capacity, meaningful on-chip memory, and extensive I/O in a compact surface-mount BGA footprint from Microchip Technology. Its specifications suit commercial embedded designs that require dense programmable logic, local memory resources, and flexible interfacing while maintaining standard commercial temperature and supply ranges.

This part is appropriate for design teams and procurement professionals targeting scalable, board-level FPGA implementations where verified device parameters—logic elements, memory size, I/O count, package, and supply range—drive selection and integration decisions.

Request a quote or submit a procurement inquiry to receive pricing and availability for the M2GL090-1FGG484 IGLOO2 FPGA.

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