M2GL090-1FG676

The M2GL090-1FG676 is an IGLOO2 field programmable gate array from Microchip Technology, delivered in a 676-ball BGA package. It provides a high count of logic resources and on-chip memory with a large number of general-purpose I/O, aimed at commercial-grade programmable-logic designs.

Key attributes include 86,316 logic elements, approximately 2.65 Mbits of embedded memory, and 425 I/O pins, all within a compact 676-FBGA (27×27) surface-mount package. The device supports core supply rails from 1.14 V to 2.625 V and operates across a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  Provides 86,316 logic elements to implement medium-to-large programmable logic functions and custom logic architectures.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM for buffering, state storage, and data processing without external memory.
• High I/O Count  425 general-purpose I/O pins support dense interface requirements and multiple parallel connections.
• Package and Mounting  676-FBGA (27×27) package, surface-mount mounting type, suitable for compact PCB layouts requiring high pin density.
• Power Supply Flexibility  Supports a voltage supply range from 1.14 V to 2.625 V to accommodate various core and I/O domain requirements.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliance  RoHS-compliant status for regulatory and environmental conformity.

Typical Applications

• Commercial embedded systems  Use the device to implement custom control logic and data-path acceleration within commercial electronic products.
• High-density I/O designs  Leverage 425 I/O pins to interface with multiple peripherals, sensors, or parallel buses in space-constrained PCBs.
• On-chip memory–intensive functions  Employ approximately 2.65 Mbits of embedded RAM for buffering, packet processing, or local data storage without external memory.
• Compact, high-pin-count implementations  The 676-FBGA package permits high integration where board area and pin density are critical.

Unique Advantages

• Substantial logic resources: 86,316 logic elements enable complex programmable logic implementations without immediate migration to larger devices.
• Integrated on-chip memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory components and simplifies board design.
• Large I/O footprint: 425 I/O pins support multiple interfaces and parallel connections, lowering the need for external I/O expanders.
• Flexible supply range: 1.14 V to 2.625 V support for a variety of core and I/O voltage schemes in commercial designs.
• Space-efficient package: 676-FBGA (27×27) offers high pin density in a compact surface-mount form factor for optimized PCB layout.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS-compliant construction for standard commercial product deployment.

Why Choose M2GL090-1FG676?

The M2GL090-1FG676 combines a large logic element count, substantial embedded memory, and a high I/O count within a compact 676-FBGA package, positioning it for demanding commercial programmable-logic tasks where integration and pin density matter. Its supply voltage flexibility and RoHS-compliant status make it suitable for a range of commercial product designs.

This part is well suited to design teams and procurement groups building commercial embedded systems that require on-chip memory, extensive I/O, and a high number of logic elements while maintaining a compact board footprint and standard commercial temperature performance.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the M2GL090-1FG676 IGLOO2 FPGA.