M2GL090-1FCSG325I

The M2GL090-1FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a programmable hardware fabric with a high logic element count and embedded memory in a compact BGA package for industrial applications.

With 86,184 logic elements, approximately 2.65 Mbits of embedded memory and 180 I/Os, this device is suited to designs requiring substantial on-chip logic capacity, flexible I/O connectivity and an extended operating temperature range.

Key Features

• Core Architecture  IGLOO2 Field Programmable Gate Array (FPGA) architecture in a single-component IC.
• Logic Capacity  86,184 logic elements to implement complex logic and custom hardware functions.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM to support buffering, state machines and data storage.
• I/O Count  180 user I/Os for broad peripheral and interface connection options.
• Power and Voltage  Wide supply range from 1.14 V to 2.625 V to accommodate varying power architectures.
• Package and Mounting  325-TFBGA package; supplier device package specified as 325-FCBGA (11×11). Surface-mount device for PCB assembly.
• Industrial Grade  Rated for an operating temperature range of −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and flexible I/O count support control logic, interface bridging and real-time decision functions.
• Embedded System Integration  High logic density and on-chip RAM enable custom glue logic, protocol handling and embedded data processing within constrained board space.
• Communications and I/O Aggregation  Large I/O complement and programmable fabric allow implementation of interface multiplexing, signal conditioning and protocol conversion.

Unique Advantages

• High Logic Density: 86,184 logic elements provide capacity for complex, highly integrated designs without external glue logic.
• Substantial On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduce dependence on external memory for buffering and state storage.
• Broad I/O Connectivity: 180 I/Os support numerous peripheral interfaces and flexible board-level integration.
• Wide Voltage Support: 1.14 V to 2.625 V supply range allows compatibility with a variety of system power rails.
• Industrial Temperature Range: −40 °C to 100 °C operation for deployment in temperature-challenging environments.
• Compact BGA Packaging: 325-TFBGA / 325-FCBGA (11×11) package balances high integration with compact board footprint.

Why Choose M2GL090-1FCSG325I?

The M2GL090-1FCSG325I combines a high logic element count, meaningful on-chip memory and a large I/O complement in a compact BGA package designed for industrial use. Its programmable IGLOO2 FPGA fabric gives engineers the flexibility to implement custom hardware functions and adapt designs over time.

Backed by Microchip Technology and specified for extended temperature operation and RoHS compliance, this device is a practical choice for embedded and industrial applications that require scalability, integration and robust on-board resources.

If you would like pricing, availability or a formal quote for the M2GL090-1FCSG325I, please submit a quote request or contact sales for assistance.