M2GL090-1FCS325

The M2GL090-1FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial-grade applications. It combines a sizable logic fabric with embedded RAM and a moderate I/O count to support a range of programmable digital designs.

With 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM, and support for up to 180 general-purpose I/Os, this device targets commercial embedded systems and programmable logic implementations that require density, flexible I/O, and low-profile BGA packaging.

Key Features

• Logic Capacity — 86,184 logic elements provide substantial programmable logic resources for complex digital designs and custom processing blocks.
• Embedded Memory — Approximately 2.65 Mbits of total on-chip RAM for data buffering, FIFOs, and temporary storage directly within the FPGA fabric.
• I/O Count — Up to 180 I/Os to interface with peripherals, sensors, and external memory or bus systems.
• Power Supply Range — Operates from 1.14 V to 2.625 V, enabling integration with a variety of core and I/O voltage domains.
• Package and Mounting — Available in a 325-ball TFBGA/FCBGA form; supplier device package listed as 325-FCBGA (11×11), optimized for surface-mount assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control, protocol conversion, or glue logic in devices where up to 180 I/Os and commercial temperature range are required.
• Data Buffering and Processing — Use on-chip RAM and logic elements for localized buffering, packet processing, or temporary data storage within FPGA-based datapaths.
• I/O Expansion and Bridging — Leverage the 180 I/Os to add programmable interface logic between processors, sensors, and peripherals in compact packages.

Unique Advantages

• High Logic Density: 86,184 logic elements enable implementation of substantial custom logic and state machines without external CPLDs or discrete logic.
• Embedded Memory Capacity: Approximately 2.65 Mbits of on-chip RAM reduces reliance on external memory for many buffering and temporary-storage needs.
• Robust I/O Count: 180 I/Os provide flexibility to connect multiple peripherals, interfaces, and buses directly to the FPGA.
• Flexible Voltage Support: Wide supply range (1.14 V to 2.625 V) allows compatibility with various core and I/O voltage requirements.
• Compact Surface-Mount Package: 325-ball TFBGA/FCBGA (325-FCBGA, 11×11) supports dense board layouts while maintaining a low-profile solution.
• Commercial Temperature Grade and RoHS Compliance: Designed for commercial environments and meets RoHS environmental standards.

Why Choose M2GL090-1FCS325?

The M2GL090-1FCS325 positions itself as a capable commercial-grade FPGA option by combining a large logic element count, meaningful on-chip RAM, and a substantial I/O complement in a compact BGA package. These characteristics make it suitable for designers who need programmable logic density and embedded memory without moving to larger or more industrially graded devices.

Backed by Microchip Technology, the device offers a balance of integration and package density for commercial embedded designs, prototyping, and production where 0 °C to 85 °C operation and RoHS compliance are required.

Request a quote or submit an inquiry to obtain pricing, availability, and procurement information for the M2GL090-1FCS325.