M2GL090-1FCSG325

The M2GL090-1FCSG325 is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology, offered in a 325-TFBGA / 325-FCBGA (11×11) package. It provides a high-density programmable logic resource targeted for commercial embedded logic and system integration.

With 86,184 logic elements, approximately 2.65 Mbits of embedded memory, and 180 user I/Os, this device is suited to designs that require substantial on-chip logic, memory resources, and flexible I/O in a compact surface-mount package.

Key Features

• Core Logic  86,184 logic elements provide extensive programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing.
• I/O Count  180 user I/Os support a wide range of peripheral and interface connections in a single device.
• Power Supply  Flexible supply range from 1.14 V to 2.625 V to accommodate different design power domains.
• Package  Available in a 325-TFBGA / 325-FCBGA (11×11) surface-mount package for space-constrained PCB layouts.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Integration of substantial programmable logic and on-chip memory in commercial electronic products.
• Embedded Processing and Glue Logic  Consolidation of interface logic, protocol handling, and custom processing functions within a single FPGA.
• High-Density I/O Interfaces  Designs requiring many user I/Os in a compact package for board-level integration.

Unique Advantages

• High Logic Density: 86,184 logic elements enable complex designs to be implemented without splitting functionality across multiple devices, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 2.65 Mbits of embedded RAM supports data buffering and local storage, reducing dependence on external memory.
• Large I/O Count: 180 user I/Os provide flexibility for interfacing with peripherals, sensors, and other system components directly from the FPGA.
• Compact Surface-Mount Package: 325-FCBGA (11×11) packaging delivers high integration density for space-constrained PCBs.
• Flexible Power Options: Supply range from 1.14 V to 2.625 V enables integration into a variety of power architectures.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, suitable for a wide range of commercial deployments while meeting RoHS requirements.

Why Choose M2GL090-1FCSG325?

The M2GL090-1FCSG325 pairs a high logic element count with significant embedded memory and extensive I/O in a compact 325-FCBGA surface-mount package, making it a practical choice for commercial embedded designs that need consolidated programmable logic and on-chip resources. Its supply voltage flexibility and commercial temperature rating simplify integration into diverse power and thermal environments.

Designed within the IGLOO2 family by Microchip Technology, this FPGA provides a clear upgrade path within the family for designs that require scalability of logic, memory, and I/O while maintaining RoHS compliance and standard commercial-grade operation.

Request a quote or contact sales to discuss availability, lead times, and pricing for the M2GL090-1FCSG325.