M2GL060TS-VFG784I

The M2GL060TS-VFG784I is an IGLOO2 FPGA in a 784-ball FBGA package (23 × 23 mm) designed for industrial applications. It integrates 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 395 user I/Os to support complex logic, high-density I/O aggregation, and embedded-memory architectures.

As part of the IGLOO2 family, this device is built on a 4‑input LUT FPGA fabric with integrated math blocks, multiple embedded memory blocks and low-power flash technology, making it suitable for designs that require secure, low-power, and reliable programmable logic in an industrial temperature range.

Key Features

• Logic Capacity — 56,520 logic elements for mid-to-high density FPGA designs and complex logic implementation.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM supporting data buffering, state machines and local storage.
• I/O Count — 395 user I/Os to support wide parallel interfaces and dense external connectivity.
• Core Architecture — 4‑input LUT based FPGA fabric with integrated math blocks and multiple embedded memory blocks (IGLOO2 family capability).
• High‑Performance Interfaces (Family) — IGLOO2 family includes high-performance SerDes lanes and integrated DDR3 memory controller capability for designs requiring fast serial links and external memory interfaces.
• Power and Voltage — Core supply voltage range 1.14 V to 1.26 V to match modern low-voltage system rails.
• Package & Mounting — 784‑FBGA (supplier package 784‑VFBGA) surface-mount package, 23 × 23 mm footprint for compact board implementations.
• Industrial Temperature Rating — Specified for operation from −40 °C to 100 °C for deployment in extended-temperature environments.
• Reliability & Security (Family) — Low-power flash technology and family-level security features including cryptographic and random-bit generation primitives as documented for IGLOO2 devices.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Complex control logic, large I/O matrices and state machines benefiting from the device’s 395 I/Os, 56,520 logic elements and industrial temperature rating.
• Network and Communications — Designs that require high-speed serial connectivity and memory interface support can leverage the IGLOO2 family’s SerDes capabilities and integrated DDR3 controller features.
• Embedded Memory Subsystems — Systems needing on-chip flash, embedded SRAM and DMA-driven data movement for buffering, logging or protocol processing.
• Secure/Protected Systems — Applications that require hardware security primitives and reliable nonvolatile configuration provided by the IGLOO2 family architecture.

Unique Advantages

• High logic density with compact footprint: 56,520 logic elements in a 23 × 23 mm 784‑FBGA package allow complex designs without a large PCB area penalty.
• Large I/O capability: 395 user I/Os enable direct interfacing to many peripherals and sensors, reducing the need for external I/O expanders.
• Low-voltage core: 1.14–1.26 V core supply aligns with low-voltage system rails for efficient power distribution.
• Extended temperature operation: −40 °C to 100 °C rating supports deployment in demanding industrial environments.
• Integrated memory and security features (family): On-chip flash, embedded SRAM and documented cryptographic/NRBG blocks support secure, robust system designs.
• RoHS compliant: Meets environmental compliance requirements for modern electronic products.

Why Choose M2GL060TS-VFG784I?

The M2GL060TS-VFG784I delivers a balanced combination of mid-to-high logic capacity, substantial embedded memory and a very large I/O count in a compact 784‑FBGA package rated for industrial temperatures. It is a suitable choice for designers building industrial control systems, communications interfaces, and secure embedded subsystems that require reliable nonvolatile configuration and integrated memory support.

Backed by IGLOO2 family documentation and timing tools referenced in the product datasheet, this device supports predictable timing closure and system-level design workflows while maintaining low-power, flash-based configuration and family-level high-performance interface capabilities.

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