M2GL090-1FCS325I

The M2GL090-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, supplied in a 325-TFBGA FCBGA package. It provides a high-density logic fabric with substantial embedded memory and a broad I/O count for industrial embedded designs.

With 86,184 logic elements, approximately 2.648 Mbits of on-chip RAM and 180 general-purpose I/O, this device targets applications that require flexible programmable logic, robust I/O connectivity and operation across an industrial temperature range.

Key Features

• Logic Capacity 86,184 logic elements (cells) to implement complex custom logic, state machines and protocol functions.
• On‑Chip Memory Approximately 2.648 Mbits of embedded RAM for data buffering, FIFOs and small local memories.
• I/O Resources 180 I/O pins to support multiple parallel interfaces and sensor/actuator connections.
• Power Supply Range Flexible core and I/O operation across a supply range of 1.14 V to 2.625 V to accommodate different system voltage domains.
• Package and Mounting 325-TFBGA (supplier package: 325-FCBGA, 11×11) in a surface-mount form factor for compact PCB integration.
• Temperature and Grade Industrial-grade device rated for operation from −40°C to 100°C for deployment in demanding environments.
• Compliance RoHS compliant, supporting regulatory and assembly requirements.

Typical Applications

• Industrial Control and Automation Leverages industrial temperature rating and abundant I/O for motor control, PLC I/O expansion, and real-time control logic.
• Embedded Processing and Glue Logic Use the FPGA fabric and on-chip RAM to implement custom accelerators, protocol bridges, and timing-critical glue logic.
• Data Aggregation and Preprocessing High I/O count and embedded memory make it suitable for collecting and buffering sensor or peripheral data before forwarding to host processors.

Unique Advantages

• High Logic Density: 86,184 logic elements enable implementation of substantial custom logic without external ASICs, reducing system complexity.
• Integrated Memory: Approximately 2.648 Mbits of embedded RAM supports on-chip buffering and fast local data storage, reducing external memory requirements.
• Robust Industrial Operation: Rated for −40°C to 100°C and labeled industrial grade, suitable for deployment in temperature-challenging environments.
• Flexible I/O Count: 180 I/O pins provide extensive connectivity for sensors, peripherals and multi-channel interfaces, simplifying board-level design.
• Compact, Surface‑Mount Package: 325-TFBGA (325-FCBGA, 11×11) minimizes PCB area while supporting high-density routing and automated assembly.
• Wide Supply Range: Operation across 1.14 V to 2.625 V enables integration with a variety of system power architectures.

Why Choose M2GL090-1FCS325I?

The M2GL090-1FCS325I IGLOO2 FPGA combines substantial logic capacity, embedded memory and a large I/O complement in a compact industrial-grade package. It is well suited for engineers seeking a programmable, integrated solution to consolidate discrete logic, implement protocol handling, or provide local data processing in industrial and embedded systems.

Choosing this device supports scalable design development and helps reduce bill-of-material complexity by integrating core logic and memory on-chip, while the RoHS compliance and surface-mount 325-TFBGA package support modern manufacturing flows.

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