M2GL090-1FGG676
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86316 676-BGA |
|---|---|
| Quantity | 1,246 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 425 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86316 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090-1FGG676 – IGLOO2 FPGA, 86,316 logic elements, 676-BGA
The M2GL090-1FGG676 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology intended for commercial-grade FPGA applications. It provides a balance of logic capacity, embedded memory, and I/O density in a compact 676-ball FBGA package.
With 86,316 logic elements, approximately 2.65 Mbits of embedded memory, and 425 I/O pins, this device is suited to commercial designs requiring substantial on-chip resources and flexible supply-voltage operation between 1.14 V and 2.625 V.
Key Features
- Logic Capacity Provides 86,316 logic elements to implement complex custom logic and programmable functions.
- Embedded Memory Approximately 2.65 Mbits of on-chip RAM (2,648,064 bits) for data buffering, state machines, and small embedded storage needs.
- I/O Density 425 general-purpose I/O pins to interface with multiple peripherals and system buses without excessive external multiplexing.
- Voltage Range Supports supply operation from 1.14 V to 2.625 V to accommodate a range of system power domains.
- Package 676-ball FBGA (27 × 27 mm) package case for high-density board integration and secure mounting.
- Mounting & Grade Surface-mount device in a commercial-grade specification, suitable for standard commercial product environments.
- Operating Temperature Rated for operation from 0 °C to 85 °C to meet typical commercial temperature requirements.
- RoHS Compliant Manufactured in compliance with RoHS environmental requirements.
Typical Applications
- Commercial FPGA designs Implement custom digital logic and control functions in commercial products that require substantial on-chip resources.
- High-density I/O systems Interface multiple sensors, peripherals, or buses using the device's 425 I/O pins to reduce external interface components.
- Embedded prototyping and production Use the 676-FBGA package and surface-mount form factor for board-level prototypes and commercial production runs.
Unique Advantages
- Significant logic capacity: 86,316 logic elements enable implementation of sizable custom logic blocks without immediate need for external logic expansion.
- On-chip memory availability: Approximately 2.65 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
- Extensive I/O flexibility: 425 I/O pins provide broad connectivity options, simplifying integration with peripherals and system interfaces.
- Flexible power support: Wide supply range from 1.14 V to 2.625 V accommodates various system power architectures.
- Commercial-ready package: 676-FBGA (27 × 27 mm) surface-mount package supports compact, reliable board-level integration for commercial products.
- Environmentally compliant: RoHS compliance supports regulatory and environmental requirements for commercial products.
Why Choose M2GL090-1FGG676?
The M2GL090-1FGG676 positions itself as a commercial-grade IGLOO2 FPGA offering a substantial mix of logic, embedded memory, and I/O in a single 676-FBGA package. Its combination of 86,316 logic elements, approximately 2.65 Mbits of on-chip RAM, and 425 I/Os makes it suitable for designers needing integrated resources while maintaining a compact board footprint.
Engineers and procurement teams seeking a commercially graded FPGA for mid- to high-density logic integration will find this device provides a balanced platform for implementing custom functions, handling multi-channel I/O, and operating across common supply-voltage ranges with RoHS compliance for environmental considerations.
Request a quote or submit your requirements to receive pricing and availability for the M2GL090-1FGG676. Our team can provide a formal quote and lead-time information to support your design and procurement process.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D