M2GL090-FCS325I

The M2GL090-FCS325I is an IGLOO2 field programmable gate array (FPGA) supplied in a 325-TFBGA / FCBGA package. It provides a balance of logic capacity, embedded memory and I/O density for industrial embedded designs.

With 86,184 logic elements, approximately 2.65 Mbits of embedded memory and 180 I/O pins, this device is aimed at applications that require mid-to-high logic integration, sustained operation across a wide temperature range, and flexible supply voltage support.

Key Features

• Core Logic  86,184 logic elements for implementing custom digital logic, state machines and glue logic directly on-chip.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM to support FIFOs, buffering and data storage within the FPGA fabric.
• I/O Density  180 general-purpose I/O pins for multi-channel interfacing and integration with external peripherals and sensors.
• Power Supply  Supports a wide voltage supply range from 1.14 V to 2.625 V to accommodate different system power domains and I/O voltage requirements.
• Package & Mounting  Available in a 325-TFBGA / 325-FCBGA (11×11) supplier device package; designed for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and specified as Industrial grade for use in harsher environments.
• Environmentally Compliant  RoHS compliant to support regulatory requirements for electronic assemblies.

Typical Applications

• Industrial Control & Automation  Industrial-grade temperature rating and broad supply range make the device suitable for control logic, motor drive interfaces and factory automation systems.
• I/O-Intensive Interface Bridging  With 180 I/O pins, the FPGA is well suited for protocol bridging, parallel sensor arrays and custom I/O aggregators.
• Embedded Data Processing  The combination of 86,184 logic elements and approximately 2.65 Mbits of embedded memory supports on-chip data buffering, preprocessing and custom signal processing blocks.

Unique Advantages

• High Logic Capacity:  86,184 logic elements provide room for complex finite state machines, data paths and custom accelerators without external ASICs.
• On-Chip Memory:  Approximately 2.65 Mbits of embedded RAM reduces reliance on external memory for intermediate buffering and improves system latency.
• Flexible I/O Count:  180 I/O pins allow consolidation of multiple interfaces and simplify board-level routing for multi-channel designs.
• Wide Supply Range:  Support for 1.14 V to 2.625 V enables integration into varied power architectures and I/O standard requirements.
• Industrial Robustness:  Rated for −40 °C to 100 °C and classified as Industrial grade to meet thermal demands of factory and field-deployed equipment.
• Surface-Mount Packaging:  325-TFBGA / 325-FCBGA (11×11) packaging provides a compact footprint for space-constrained PCBs.

Why Choose M2GL090-FCS325I?

The M2GL090-FCS325I combines substantial logic capacity, embedded RAM and a high I/O count in an industrial-grade FPGA package. Its electrical and thermal specifications make it suitable for embedded systems that require reliable operation across a wide temperature range and flexible power domains.

This device is appropriate for engineers and designers building industrial control, interface aggregation and embedded data-processing solutions that benefit from on-chip integration to reduce BOM complexity and improve system responsiveness.

Request a quote or submit a price inquiry to receive availability and lead-time information for the M2GL090-FCS325I. Our team can provide part-specific purchasing details and support for your procurement process.