M2GL090-FCS325

The M2GL090-FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC offered in a 325-FCBGA (11×11) surface-mount package. It provides a balance of programmable logic capacity, on-chip memory and I/O density suitable for commercial electronic designs.

Key device characteristics include 86,184 logic elements, approximately 2.65 Mbits of embedded memory, 180 I/O pins, a 1.14 V to 2.625 V supply range, and a commercial operating temperature of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  86,184 logic elements provide the programmable fabric for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM for data buffering, FIFOs and small lookup tables.
• I/O and Packaging  180 user I/O pins in a compact 325-TFBGA (325-FCBGA, 11×11) package, supporting high-density board layouts and surface-mount assembly.
• Power  Flexible supply range from 1.14 V to 2.625 V to accommodate a variety of system-level power domains.
• Thermal and Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant for compliance with common environmental requirements.

Typical Applications

• Commercial Embedded Systems  Programmable logic implementations where moderate-density FPGA resources and on-chip memory support feature integration.
• I/O-Intensive Interfaces  Designs that require up to 180 configurable I/Os for interfacing multiple peripherals or devices.
• Compact Board Designs  Applications that benefit from a high-density 325-FCBGA package to save PCB area while keeping surface-mount assembly.
• Low-Voltage Systems  Systems operating within a 1.14 V to 2.625 V supply envelope that require programmable logic.

Unique Advantages

• Substantial Logic Capacity: 86,184 logic elements enable implementation of complex logic and control functions without external ASICs.
• On-Chip Memory Resources: Approximately 2.65 Mbits of embedded RAM reduce dependence on external memory for mid-sized buffering and state storage.
• High I/O Count in a Small Package: 180 I/Os in a 325-FCBGA (11×11) package balance connectivity and board space efficiency.
• Wide Supply Flexibility: Support for 1.14 V to 2.625 V operation accommodates diverse system power rails and design choices.
• Commercial Temperature Qualification: Rated for 0 °C to 85 °C to match standard commercial product environments.
• RoHS Compliance: Environmentally compliant manufacturing status simplifies regulatory tracking and procurement.

Why Choose M2GL090-FCS325?

The M2GL090-FCS325 delivers a mid-to-high density IGLOO2 FPGA option that combines a substantial number of logic elements, multiple megabits of embedded memory and a high I/O count in a compact 325-FCBGA surface-mount package. Its flexible supply range and commercial temperature rating make it suitable for a range of commercial electronic designs that need programmable logic integration without external memory or large packages.

This device is well suited for engineers and procurement teams seeking a RoHS-compliant FPGA solution that balances logic capacity, on-chip RAM and I/O density while maintaining a compact footprint and common commercial operating range.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the M2GL090-FCS325.