M2GL090-FCSG325

The M2GL090-FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high logic density FPGA architecture with on-chip embedded memory and a broad I/O complement for programmable digital designs.

Designed for commercial-temperature applications, this device offers a balance of logic capacity, embedded RAM, and a compact 325-FCBGA (11×11) surface-mount package to support board-level integration and system customization.

Key Features

• Logic Capacity — 86,184 logic elements suitable for sizable custom logic implementations and complex finite state machines.
• Embedded Memory — Approximately 2.65 Mbits of on-chip RAM for data buffering, lookup tables, and local storage.
• I/O Resources — 180 user I/Os to interface with external peripherals, sensors, and other system components.
• Power Supply Range — Operates from 1.14 V to 2.625 V to accommodate different core and I/O supply configurations.
• Package and Mounting — 325-TFBGA (325-FCBGA, 11×11) surface-mount package for compact board-level integration.
• Operating Temperature — Commercial grade operation over 0 °C to 85 °C for standard ambient environments.
• Environmental Compliance — RoHS compliant for environmentally conscious design and manufacturing.

Typical Applications

• Custom logic acceleration — Implement application-specific data paths and control logic using 86,184 logic elements and approximately 2.65 Mbits of embedded memory.
• I/O-intensive interfaces — Use 180 user I/Os to connect multiple peripherals, sensors, or external devices at the board level.
• Compact system integration — The 325-FCBGA (11×11) surface-mount package enables space-efficient placement on compact PCBs.

Unique Advantages

• High logic density: 86,184 logic elements provide substantial programmable resources for mid-to-large scale designs.
• Significant on-chip RAM: Approximately 2.65 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Generous I/O count: 180 I/Os simplify interfacing to multiple peripherals and system buses without additional GPIO expanders.
• Flexible supply range: 1.14 V to 2.625 V operation accommodates varied power architectures and I/O voltage requirements.
• Compact surface-mount package: 325-FCBGA (11×11) supports dense board layouts and mechanical stability for surface-mount assembly.
• RoHS compliant: Meets lead-free and hazardous substance restrictions for regulatory and manufacturing needs.

Why Choose M2GL090-FCSG325?

The M2GL090-FCSG325 combines a high logic element count with substantial embedded memory and a large I/O complement in a compact surface-mount FCBGA package. Its commercial temperature rating and wide supply-range flexibility make it suitable for a range of board-level programmable logic applications where on-chip resources and I/O density matter.

This IGLOO2 FPGA is well suited for engineers and teams seeking a scalable, integrated programmable-logic building block that simplifies system design by reducing external memory and I/O component needs while supporting compact PCB layouts and RoHS-compliant manufacturing.

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