M2GL090-FGG484I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86184 484-BGA |
|---|---|
| Quantity | 992 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86184 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090-FGG484I – IGLOO2 Field Programmable Gate Array, 86184 logic elements
The M2GL090-FGG484I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial embedded applications. It combines a large programmable fabric with substantial on-chip memory and a high I/O count to support complex logic, control and interface tasks.
With 86,184 logic elements, approximately 2.65 Mbits of embedded memory and 267 I/O pins in a 484-ball BGA package, this device is suited for designs that require dense logic, significant buffering or lookup storage, and a wide ambient operating range.
Key Features
- Logic Capacity 86,184 logic elements provide a high-density programmable fabric for implementing complex digital functions.
- Embedded Memory Approximately 2.65 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
- High I/O Count 267 user I/O pins enable broad connectivity for sensors, peripherals and multiple interface channels.
- Power Supply Range Supports a core and I/O supply range from 1.14 V to 2.625 V for flexible power-domain integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial ambient requirements.
- Package and Mounting 484-BGA (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount format for compact board-level integration.
- Environmental Compliance RoHS compliant for regulatory and manufacturing requirements.
Typical Applications
- Industrial Control and Automation Implement motor control logic, real-time I/O aggregation and deterministic control functions using the device's logic density and industrial temperature rating.
- Embedded Signal Processing Use on-chip memory and abundant logic elements for packet buffering, protocol handling or custom data-path acceleration.
- High-Density I/O Systems Aggregate and interface multiple sensors, buses or peripherals across the device's 267 I/O pins for compact system designs.
Unique Advantages
- High logic integration: 86,184 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board area.
- Substantial embedded memory: Approximately 2.65 Mbits of on-chip RAM minimizes reliance on external memory for many buffering and lookup tasks.
- Extensive I/O availability: 267 I/O pins support complex interfacing and parallel connectivity without external GPIO expanders.
- Wide power flexibility: A supply range from 1.14 V to 2.625 V allows integration into varied power architectures and mixed-voltage systems.
- Industrial-grade operation: −40 °C to 100 °C operating range supports deployment in demanding ambient environments.
- Compact BGA footprint: 484-BGA (23 × 23 mm) package enables high-density PCB designs while maintaining robust thermal and signal routing characteristics.
- RoHS compliance: Conforms to RoHS requirements for lead-free manufacturing processes.
Why Choose M2GL090-FGG484I?
The M2GL090-FGG484I positions itself as a high-capacity IGLOO2 FPGA option for industrial embedded designers who need significant logic resources, meaningful on-chip memory and a large number of I/Os in a compact BGA package. Its power supply flexibility and industrial temperature rating make it suitable for a wide range of board- and system-level implementations where integration and reliability are important.
Manufactured by Microchip Technology, this device is aimed at teams building complex control, interface or signal-processing solutions that benefit from consolidating functions into a single programmable device to simplify design and reduce component count.
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