M2GL090-FGG676

The M2GL090-FGG676 is an IGLOO2 Field Programmable Gate Array (FPGA) manufactured by Microchip Technology. It provides a commercial-grade, programmable logic solution with a high logic element count, substantial on-chip RAM, and dense I/O to address complex digital designs.

With 86,316 logic elements, approximately 2.65 Mbits of embedded memory, and 425 I/O, this surface-mount FPGA in a 676-FBGA (27×27) package is suited to commercial applications that require significant logic integration and broad I/O connectivity within a defined operating temperature range.

Key Features

• Core / Logic  86,316 logic elements provide ample programmable fabric for implementing complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 2.65 Mbits of on-chip RAM supports data buffering, state storage, and embedded memory needs without relying solely on external memory.
• I/O Density  425 I/O pins deliver broad interface capability for connecting sensors, peripherals, and external devices directly to the FPGA fabric.
• Power Supply Range  Supported supply voltage range from 1.14 V to 2.625 V enables flexibility in system power architectures that meet the device's specified requirements.
• Package & Mounting  676-FBGA (27×27) package in a surface-mount form factor provides a compact footprint for board-level integration.
• Operating Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for commercial electronic products and environments within that range.
• Regulatory Compliance  RoHS compliant, meeting common lead-free and hazardous substance requirements for commercial electronic assemblies.

Typical Applications

• Commercial Embedded Systems  Implement custom digital logic, peripheral aggregation, and application-specific processing using the FPGA’s 86,316 logic elements and embedded memory.
• High-Density I/O Control  Systems that require extensive parallel or multiplexed interfaces can leverage the 425 I/O pins for broad connectivity to sensors, displays, or I/O subsystems.
• Prototyping and Low-Volume Production  The programmable IGLOO2 device is suitable for validating digital designs and deploying commercial products where reconfigurability and integration matter.

Unique Advantages

• High Logic Integration:  86,316 logic elements reduce reliance on multiple discrete logic devices, simplifying board-level design.
• On-Chip Memory Capacity:  Approximately 2.65 Mbits of embedded RAM supports local data storage and buffering, decreasing external memory needs.
• Extensive I/O Count:  425 I/O pins provide flexibility for complex interfacing and expandability without additional bridge devices.
• Compact, Surface-Mount Package:  676-FBGA (27×27) packaging enables a dense, manufacturable footprint for space-constrained commercial products.
• Commercial Temperature Rating:  Rated 0 °C to 85 °C to match typical commercial application environments and deployment scenarios.
• RoHS Compliant:  Meets RoHS requirements, supporting lead-free manufacturing and regulatory compliance for commercial products.

Why Choose M2GL090-FGG676?

The M2GL090-FGG676 positions itself as a commercially graded IGLOO2 FPGA offering a balance of high logic density, embedded memory, and extensive I/O in a compact 676-FBGA package. These characteristics make it well suited for designers who need to integrate substantial programmable logic and connectivity into commercial products operating between 0 °C and 85 °C.

Backed by Microchip Technology and documented in the IGLOO2 datasheet, this device is appropriate for teams seeking a programmable solution that consolidates logic functions, reduces BOM complexity, and supports RoHS-compliant manufacturing.

Request a quote or submit your requirements to receive pricing and availability for the M2GL090-FGG676. Our team can provide the information needed to evaluate this IGLOO2 FPGA for your commercial designs.