M2GL090T-1FCSG325

The M2GL090T-1FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) in a 325-TFBGA (11×11) surface-mount package. It provides 86,184 logic elements and approximately 2.65 Mbits of embedded memory, with up to 180 I/O pins and a wide supply voltage window. This device targets commercial applications that require substantial on-chip logic capacity, flexible I/O, and low-power operation within a 0 °C to 85 °C operating range.

Key Features

• Logic Fabric 86,184 logic elements (LEs) for implementing complex digital functions and custom logic architectures.
• Embedded Memory Approximately 2.65 Mbits of on-chip RAM to support buffering, state storage, and data processing functions without external memory.
• I/O Capability 180 I/O pins to connect multiple peripherals, buses, and external devices while keeping designs compact.
• Power and Supply Range Operates from 1.14 V to 2.625 V, enabling flexible power-domain integration and support for varying core/I/O voltage requirements.
• Package and Mounting 325-TFBGA (325-FCBGA, 11×11) surface-mount package for high-density PCB implementations and reliable mechanical performance.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operating temperature, suitable for commercial electronics and controlled-environment applications.
• RoHS Compliant Meets RoHS environmental requirements for lead-free manufacturing and reduced hazardous substances.

Typical Applications

• Custom Digital Processing — Implement application-specific logic, data-paths, and control systems using the device’s 86,184 logic elements and embedded RAM.
• Peripheral and Bus Bridging — Use the 180 I/O pins to interface with sensors, communications peripherals, and memory subsystems in compact designs.
• Prototyping and Development — Leverage the IGLOO2 FPGA’s capacity and package density for board-level prototyping of medium-to-large scale digital designs.

Unique Advantages

• High Logic Density: 86,184 logic elements provide the headroom to implement complex finite-state machines, datapaths, and custom accelerators on-chip.
• Integrated On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces the need for external memory, simplifying BOM and layout.
• Flexible I/O Count: 180 I/O pins enable direct connectivity to multiple external components, minimizing glue logic and multiplexing.
• Wide Supply Window: 1.14 V to 2.625 V supply range supports diverse power-rail designs and integration with different voltage domains.
• Compact, High-Density Package: 325-TFBGA (11×11) surface-mount package supports space-constrained PCBs while delivering robust soldered performance.
• Commercial Temperature Rating: 0 °C to 85 °C specification aligns with typical commercial product deployments and lab environments.

Why Choose M2GL090T-1FCSG325?

The M2GL090T-1FCSG325 IGLOO2 FPGA balances substantial logic capacity and on-chip memory with flexible I/O and a compact 325-TFBGA package. Its supply voltage range and commercial temperature rating make it suitable for a wide range of commercial electronic systems where integration density and configurable hardware are important.

Design teams seeking a high-density FPGA solution for prototyping, custom logic implementation, or mid-scale production designs will find the M2GL090T-1FCSG325 delivers a combination of logic resources, embedded RAM, and I/O that supports scalable, board-level integration while remaining RoHS compliant.

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