M2GL090-FGG676I

The M2GL090-FGG676I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial embedded applications. This device provides a high logic element count together with on-chip RAM and extensive I/O capability, enabling custom digital functions where density, configurable I/O and reliable operation across a wide temperature range are required.

With 86,184 logic elements, approximately 2.648 Mbits of embedded memory and up to 425 I/O, the device targets designs that need substantial programmable logic and memory resources in a compact 676-ball BGA package.

Key Features

• Logic Density  86,184 logic elements for implementing large-scale programmable logic designs.
• Embedded Memory  Approximately 2.648 Mbits of on-chip RAM to support data buffering, state storage and memory-intensive user logic.
• High I/O Count  Up to 425 I/O pins to interface with multiple peripherals, sensors and external devices.
• Power Supply Range  Operates from 1.14 V to 2.625 V, allowing flexibility across different system voltage domains.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package  676-ball BGA (supplier package: 676-FBGA, 27 × 27 mm) in a surface-mount form factor for dense board layouts.
• RoHS Compliant  Conforms to RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation  Use the device’s industrial temperature rating and high I/O count for control logic, sensor interfacing and protocol bridging in factory and process automation.
• Embedded Systems  Deploy in embedded designs that require substantial programmable logic and on-chip RAM for custom data processing and timing-critical functions.
• High-Density I/O Platforms  Leverage up to 425 I/O for applications needing many external connections such as communication gateways, I/O expanders and board-level interfaces.

Unique Advantages

• High Logic Capacity: 86,184 logic elements enable implementation of complex logic and state machines without external FPGA partitioning.
• Significant On-Chip Memory: Approximately 2.648 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Flexible I/O Provisioning: Up to 425 I/O pins support extensive peripheral connectivity and multi-signal designs.
• Wide Supply Range: Operation from 1.14 V to 2.625 V accommodates a variety of power architectures and voltage domains.
• Industrial Robustness: Rated for −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact Surface-Mount Package: 676-ball BGA (27 × 27 mm) enables high-density PCB integration while maintaining a large feature set.

Why Choose M2GL090-FGG676I?

The M2GL090-FGG676I balances high logic density, embedded memory and large I/O capacity in a single industrial-grade FPGA package. It is well suited to engineers designing robust embedded and industrial systems that require configurable logic, significant on-chip RAM and broad external connectivity while operating across a wide temperature range.

For designs that demand scalable programmable resources and compact board-level integration, this IGLOO2 FPGA provides a clear hardware foundation with verifiable specifications for logic, memory, I/O, supply flexibility and thermal performance.

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