M2GL090T-FCSG325

The M2GL090T-FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC offered in a 325-ball FCBGA (11×11) package for surface-mount assembly. It provides a high count of programmable logic and embedded memory in a commercial-grade device suited for space-constrained board designs.

With 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM, and 180 I/O, this FPGA targets complex digital designs that require substantial logic density, embedded memory, and flexible I/O within a compact package footprint.

Key Features

• Logic Capacity: 86,184 logic elements for implementing large-scale digital systems and custom logic functions.
• Embedded Memory: Approximately 2.65 Mbits of total on-chip RAM for data buffering, state storage, and memory-intensive logic.
• I/O Count: 180 programmable I/O pins to support multiple interfaces and peripheral connections on a single device.
• Power: Wide supply voltage support from 1.14 V to 2.625 V to accommodate a range of system power architectures.
• Package and Mounting: Supplied in a 325-TFBGA (325-FCBGA, 11×11) surface-mount package for high-density PCB integration.
• Operating Range: Commercial temperature grading with an operating range of 0 °C to 85 °C.
• Regulatory: RoHS compliant, supporting environmental and solderability requirements for modern electronics manufacturing.

Typical Applications

• Complex digital subsystems: Leverage 86,184 logic elements and embedded RAM to implement large combinational and sequential logic blocks on a single device.
• Interface aggregation: Use the 180 I/O pins to consolidate multiple peripheral and bus interfaces into one FPGA for streamlined board designs.
• On-board buffering and data handling: Approximately 2.65 Mbits of embedded memory enable local data storage and buffering for real-time processing tasks.

Unique Advantages

• High logic density: 86,184 logic elements allow designers to integrate complex functions and reduce the need for multiple discrete ICs.
• Substantial on-chip memory: Approximately 2.65 Mbits of RAM lowers external memory requirements and simplifies routing and BOM.
• Generous I/O availability: 180 I/O pins provide flexibility for connecting sensors, peripherals, and multiple buses without extensive multiplexing.
• Compact, surface-mount package: 325-FCBGA (11×11) delivers a small footprint for space-constrained PCBs while supporting high pin count integration.
• Flexible power support: A 1.14 V to 2.625 V supply range accommodates varied power architectures and voltage-domain designs.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products.

Why Choose M2GL090T-FCSG325?

The M2GL090T-FCSG325 positions itself as a compact, high-density FPGA option for designs that require substantial programmable logic, embedded memory, and wide I/O support in a single surface-mount package. Its combination of 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM, and 180 I/O makes it well suited to developers consolidating multiple functions onto one device while maintaining a small PCB footprint.

Engineers selecting this commercial-grade IGLOO2 FPGA benefit from clear electrical and environmental specifications—1.14 V to 2.625 V supply range, 0 °C to 85 °C operating temperature, and RoHS compliance—supporting predictable integration into production designs and long-term deployments.

Request a quote or contact sales to discuss availability and volume pricing for the M2GL090T-FCSG325.