OR2C15A4S240-DBA1357
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,512 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 240-SQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 188 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 1600 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 25600 |
Overview of OR2C15A4S240-DBA1357 – Field Programmable Gate Array (FPGA) IC
The OR2C15A4S240-DBA1357 is a commercial-grade Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It integrates 1,600 logic elements with approximately 25,600 bits of embedded RAM and provides 188 general-purpose I/O pins in a 240-lead package, targeting applications that require moderate logic density and extensive I/O connectivity.
Designed for surface-mount assembly and RoHS compliance, this device operates from a 4.75 V to 5.25 V supply and supports an operating temperature range of 0°C to 70°C.
Key Features
- Core / Logic 1,600 logic elements provide configurable resources for implementing custom digital logic and moderate-complexity designs.
- Embedded Memory Approximately 25,600 bits of on-chip RAM for local storage and buffering within user designs.
- I/O Count 188 available input/output pins to support wide peripheral connectivity and parallel interfacing.
- Power Single-supply operation from 4.75 V to 5.25 V, simplifying integration with 5 V systems and legacy interfaces.
- Package & Mounting 240-lead package (240-BFQFP; supplier device package listed as 240-SQFP, 32×32) in a surface-mount form factor suitable for PCB assembly.
- Commercial Grade & Temperature Rated for commercial operation with an ambient temperature range of 0°C to 70°C.
- Environmental Compliance RoHS compliant for reduced hazardous-material content in manufacturing and deployment.
Unique Advantages
- Balanced Logic Density: 1,600 logic elements provide a middle-ground resource set for implementing custom logic without excessive complexity.
- On‑Chip Memory Availability: Approximately 25,600 bits of embedded RAM reduce the need for external memory for buffering and small data stores.
- High I/O Capacity: 188 I/O pins enable broad peripheral and bus interfacing options on a single device, lowering external component count.
- 5 V System Compatibility: Operation from 4.75 V to 5.25 V simplifies integration into existing 5 V designs and legacy interfaces.
- Surface-Mount, 240-Lead Packaging: Dense 240-lead package supports compact PCB layouts while providing extensive pinout options.
- RoHS Compliance: Meets environmental restrictions for lead and other substances common in modern electronic assemblies.
Why Choose OR2C15A4S240-DBA1357?
The OR2C15A4S240-DBA1357 offers a compact, surface-mount FPGA solution that combines 1,600 logic elements, approximately 25,600 bits of embedded RAM, and 188 I/Os in a 240-lead package. Its 5 V supply range, commercial temperature rating (0°C to 70°C), and RoHS compliance make it suitable for a wide range of commercial electronic designs that require moderate logic capacity and substantial I/O connectivity.
This device is well suited for designers and procurement teams looking for a mid-density FPGA option with clear electrical and packaging specifications, facilitating straightforward integration into 5 V systems and standard PCB assembly flows.
Request a quote or submit an inquiry for pricing and availability of OR2C15A4S240-DBA1357. Our team will provide lead time and ordering information to support your design and procurement needs.