OR2C26A3PS208-N-DB

The OR2C26A3PS208-N-DB is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation intended for commercial-grade, surface-mount applications. It integrates 2,304 logic elements, 36,864 bits of on-chip RAM, and 168 general-purpose I/O in a 208-pin exposed-pad package.

Operating from a 4.5 V to 5.5 V supply and rated for 0 °C to 70 °C, this device is suited to commercial embedded systems that require field-programmable logic and moderate I/O density.

Key Features

• Logic Resources — 2,304 logic elements provide a programmable fabric for implementing custom logic and control functions.
• Embedded Memory — 36,864 bits of on-chip RAM (approximately 0.037 Mbits) for data buffering, state storage, and small lookup tables.
• I/O Capacity — 168 I/O pins to support multiple peripheral interfaces and signal routing in compact system designs.
• Power — Single-supply operation from 4.5 V to 5.5 V to match common commercial power rails.
• Package and Mounting — 208‑BFQFP with exposed pad (supplier device package: 208‑SQFP2, 28×28) in a surface-mount format for PCB assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 70 °C.
• Compliance — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Field-programmable logic for custom control, glue logic, and protocol adaptation in equipment rated for commercial temperature ranges.
• I/O-Dense Designs — Systems requiring up to 168 general-purpose I/O lines for peripheral interfacing and board-level connectivity.
• On-Chip Memory Tasks — Small buffering and lookup-table functions using 36,864 bits of embedded RAM.

Unique Advantages

• Programmable Flexibility: The FPGA architecture with 2,304 logic elements enables custom logic implementation and post-production updates.
• Integrated Memory: Built-in 36,864 bits of RAM reduces the need for external memory for small data storage tasks, simplifying BOM and layout.
• High I/O Count: 168 I/O pins accommodate multiple interfaces and signal expansion without additional I/O expander ICs.
• Standard Power Envelope: 4.5 V to 5.5 V supply compatibility aligns with common commercial power rails for straightforward integration.
• Surface-Mount Package: 208‑BFQFP exposed-pad package supports compact PCB designs and thermal management via exposed pad.
• RoHS Compliant: Supports lead-free assembly and regulatory compliance for commercial products.

Why Choose OR2C26A3PS208-N-DB?

The OR2C26A3PS208-N-DB combines a balanced set of logic, memory, and I/O resources in a commercial-grade FPGA package from Lattice Semiconductor Corporation. Its 2,304 logic elements and 36,864 bits of on-chip RAM provide the programmable capacity needed for custom logic, protocol bridging, and control tasks while keeping system complexity and external component count low.

This device is well-suited to designers of commercial embedded systems who need a field-programmable solution with a high I/O count, standard 5 V-range power, and a compact 208-pin surface-mount package. RoHS compliance and an exposed-pad BFQFP footprint make it practical for modern, lead-free PCB assembly and thermal considerations.

Request a quote or submit an inquiry to receive pricing and availability for the OR2C26A3PS208-N-DB. Our team can provide lead-time information and support for integrating this FPGA into your commercial designs.