OR2C26A4PS240-DB

The OR2C26A4PS240-DB is an ORCA™2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It integrates 2,304 logic elements, 36,864 bits of on‑chip RAM and 192 user I/O in a 240‑lead BFQFP exposed pad package. Designed for commercial‑grade systems, the device operates from a 4.75 V to 5.25 V supply and across a 0 °C to 70 °C temperature range, offering a compact, surface‑mount solution for mid‑density programmable logic needs.

Key Features

• Core Logic 2,304 logic elements providing flexible, reprogrammable logic resources for custom digital functions.
• Configurable Logic Blocks (CLBs) 576 CLBs to structure and organize implemented logic efficiently.
• Embedded Memory 36,864 bits of on‑chip RAM (approximately 0.037 Mbits) for data buffering, small FIFOs, and state storage.
• I/O Capacity 192 user I/O pins to support multiple peripheral interfaces and parallel connectivity.
• Gate Count 63,600 logic gates for estimating integration density and system partitioning.
• Power Single supply operation from 4.75 V to 5.25 V for compatibility with standard 5 V systems.
• Package & Mounting 240‑lead BFQFP exposed pad (supplier package 240‑SQFP2, 32×32) in a surface‑mount form factor for PCB assembly.
• Commercial Temperature Range Rated for 0 °C to 70 °C operation for commercial applications.
• Regulatory RoHS compliant.

Typical Applications

• Custom Logic and Glue Logic — Implement glue logic, protocol adaptation, and control functions using the device’s 2,304 logic elements and 576 CLBs.
• I/O Expansion and Peripheral Bridging — Use the 192 I/O pins to add parallel interfaces, bridge buses, or aggregate multiple peripheral signals.
• Embedded Memory Tasks — Leverage 36,864 bits of on‑chip RAM for buffering, small data queues, and state machines within embedded designs.

Unique Advantages

• Balanced Logic Density: 2,304 logic elements and 63,600 gates provide a middle ground between small CPLDs and larger FPGAs for compact system designs.
• High I/O Count: 192 user I/O pins enable multiple interfaces and parallel signal handling without external I/O expanders.
• Compact, Surface‑Mount Package: 240‑lead BFQFP with exposed pad fits space‑constrained PCBs while supporting thermal management through the exposed pad.
• Simplified Power Integration: Operates on a standard 4.75 V–5.25 V supply, easing integration into existing 5 V power domains.
• Compliance and Assembly: RoHS compliance and surface‑mount packaging align with modern manufacturing and environmental requirements.

Why Choose OR2C26A4PS240-DB?

The OR2C26A4PS240-DB delivers a practical combination of logic capacity, on‑chip memory, and a high I/O count in a single, commercial‑grade FPGA package. It’s well suited for designers who need mid‑density programmable logic for glue logic, interface bridging, and embedded control without moving to larger, more complex FPGAs.

With a standardized 5 V supply range, surface‑mount 240‑BFQFP exposed pad package, and RoHS compliance, this part offers straightforward integration into existing designs and manufacturing flows while providing the reprogrammability and flexibility expected from the ORCA™2 family.

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