OR2C26A4PS304-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 256 36864 2304 304-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,959 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 304-SQFP2 (40x40) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 304-BFQFP Exposed Pad | Number of I/O | 256 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 2304 | ||
| Number of Gates | 63600 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of OR2C26A4PS304-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC, 256 I/O, 2,304 Logic Elements, 36,864 bits RAM, 304-BFQFP Exposed Pad
The OR2C26A4PS304-DB is an ORCA™2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for commercial electronic designs. It provides a mid-range logic fabric with clearly stated on-chip resources and I/O capability for embedded digital designs and system integration.
With 2,304 logic elements, approximately 36,864 bits of embedded RAM, and 256 user I/O pins in a 304-BFQFP exposed pad surface-mount package, this device is targeted at applications that require a balance of logic density, on-chip memory and a high I/O count operating from a 4.75 V to 5.25 V supply within a 0 °C to 70 °C commercial temperature range.
Key Features
- Core Logic – 2,304 logic elements providing programmable combinational and sequential resources suitable for mid-range integration tasks.
- Embedded Memory – Approximately 36,864 bits of on-chip RAM to support buffering, small FIFOs or local data storage without external memory.
- I/O and Gate Count – 256 user I/O pins and 63,600 gates to accommodate complex interface requirements and glue-logic functions.
- Power – Supports a standard 4.75 V to 5.25 V supply for compatibility with 5 V system domains.
- Package and Mounting – 304-BFQFP exposed pad (supplier device package: 304-SQFP2, 40×40) in a surface-mount form factor for board-level assembly.
- Operating Conditions – Commercial grade operation rated from 0 °C to 70 °C for consumer and general-purpose applications.
- RoHS Compliance – Device is RoHS compliant.
Typical Applications
- Consumer Electronics – Implement control logic, protocol translation and user interface functions where a 5 V supply and commercial temperature range are suitable.
- Embedded Control – Use for digital control tasks and I/O expansion requiring a mid-range number of logic elements and a high I/O count.
- Prototyping and Evaluation – Suitable for development and evaluation of digital designs that need on-chip RAM and a configurable logic fabric in a standard SMD package.
- Communications Glue Logic – Implement interface bridging, protocol glue, and timing adaptation using the device’s I/O capacity and gate resources.
Unique Advantages
- Balanced Logic and Memory: 2,304 logic elements combined with approximately 36,864 bits of embedded RAM provide integrated resources for many mid-range designs without immediate need for external memory.
- High I/O Density: 256 user I/O pins reduce the need for external multiplexing when connecting multiple peripherals or interfaces.
- 5 V System Compatibility: Native operation across 4.75 V to 5.25 V supply rails supports legacy and common 5 V system domains.
- Board-Level Packaging: 304-BFQFP exposed pad surface-mount package supports compact board layouts and provides a path for board-level thermal management.
- Commercial Temperature Rating: Rated 0 °C to 70 °C to match requirements for consumer and other commercial electronic products.
- RoHS Compliance: Environmentally compliant for applications requiring lead-free components.
Why Choose OR2C26A4PS304-DB?
The OR2C26A4PS304-DB delivers a practical combination of logic density, embedded RAM and a high I/O count in a commercial-grade FPGA package from Lattice Semiconductor Corporation. Its specification set — including 2,304 logic elements, approximately 36,864 bits of on-chip RAM, 256 I/Os, and a standard 5 V supply range — makes it suitable for designers seeking a mid-range programmable logic device for consumer, embedded and prototype applications.
This device is well suited to teams that need a predictable, documented resource set and a surface-mount 304-BFQFP exposed pad package for compact board designs. It offers a consistent platform for scaling designs within the ORCA™2 family and supports development workflows that prioritize clear on-chip resources and standard commercial operating conditions.
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