OR2C26A4PS304-DB

FPGA, 576 CLBS, 27600 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 256 36864 2304 304-BFQFP Exposed Pad

Quantity 1,959 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package304-SQFP2 (40x40)GradeCommercialOperating Temperature0°C – 70°C
Package / Case304-BFQFP Exposed PadNumber of I/O256Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells2304
Number of Gates63600ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of OR2C26A4PS304-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC, 256 I/O, 2,304 Logic Elements, 36,864 bits RAM, 304-BFQFP Exposed Pad

The OR2C26A4PS304-DB is an ORCA™2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for commercial electronic designs. It provides a mid-range logic fabric with clearly stated on-chip resources and I/O capability for embedded digital designs and system integration.

With 2,304 logic elements, approximately 36,864 bits of embedded RAM, and 256 user I/O pins in a 304-BFQFP exposed pad surface-mount package, this device is targeted at applications that require a balance of logic density, on-chip memory and a high I/O count operating from a 4.75 V to 5.25 V supply within a 0 °C to 70 °C commercial temperature range.

Key Features

  • Core Logic – 2,304 logic elements providing programmable combinational and sequential resources suitable for mid-range integration tasks.
  • Embedded Memory – Approximately 36,864 bits of on-chip RAM to support buffering, small FIFOs or local data storage without external memory.
  • I/O and Gate Count – 256 user I/O pins and 63,600 gates to accommodate complex interface requirements and glue-logic functions.
  • Power – Supports a standard 4.75 V to 5.25 V supply for compatibility with 5 V system domains.
  • Package and Mounting – 304-BFQFP exposed pad (supplier device package: 304-SQFP2, 40×40) in a surface-mount form factor for board-level assembly.
  • Operating Conditions – Commercial grade operation rated from 0 °C to 70 °C for consumer and general-purpose applications.
  • RoHS Compliance – Device is RoHS compliant.

Typical Applications

  • Consumer Electronics – Implement control logic, protocol translation and user interface functions where a 5 V supply and commercial temperature range are suitable.
  • Embedded Control – Use for digital control tasks and I/O expansion requiring a mid-range number of logic elements and a high I/O count.
  • Prototyping and Evaluation – Suitable for development and evaluation of digital designs that need on-chip RAM and a configurable logic fabric in a standard SMD package.
  • Communications Glue Logic – Implement interface bridging, protocol glue, and timing adaptation using the device’s I/O capacity and gate resources.

Unique Advantages

  • Balanced Logic and Memory: 2,304 logic elements combined with approximately 36,864 bits of embedded RAM provide integrated resources for many mid-range designs without immediate need for external memory.
  • High I/O Density: 256 user I/O pins reduce the need for external multiplexing when connecting multiple peripherals or interfaces.
  • 5 V System Compatibility: Native operation across 4.75 V to 5.25 V supply rails supports legacy and common 5 V system domains.
  • Board-Level Packaging: 304-BFQFP exposed pad surface-mount package supports compact board layouts and provides a path for board-level thermal management.
  • Commercial Temperature Rating: Rated 0 °C to 70 °C to match requirements for consumer and other commercial electronic products.
  • RoHS Compliance: Environmentally compliant for applications requiring lead-free components.

Why Choose OR2C26A4PS304-DB?

The OR2C26A4PS304-DB delivers a practical combination of logic density, embedded RAM and a high I/O count in a commercial-grade FPGA package from Lattice Semiconductor Corporation. Its specification set — including 2,304 logic elements, approximately 36,864 bits of on-chip RAM, 256 I/Os, and a standard 5 V supply range — makes it suitable for designers seeking a mid-range programmable logic device for consumer, embedded and prototype applications.

This device is well suited to teams that need a predictable, documented resource set and a surface-mount 304-BFQFP exposed pad package for compact board designs. It offers a consistent platform for scaling designs within the ORCA™2 family and supports development workflows that prioritize clear on-chip resources and standard commercial operating conditions.

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