OR2C26A4PS208I-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 171 36864 2304 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 653 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP2 (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 171 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 2304 | ||
| Number of Gates | 63600 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of OR2C26A4PS208I-DB – ORCA™2 FPGA, 2304 logic elements, 171 I/O
The OR2C26A4PS208I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, providing a compact, configurable logic solution for industrial-grade embedded designs. It combines 2,304 logic elements, 36,864 bits of on-chip RAM and up to 171 general-purpose I/O pins in a 208-BFQFP exposed pad package.
Designed for systems that require flexible programmable logic with a standard 4.5 V to 5.5 V supply and extended operating range, this device targets industrial control and embedded applications that need a balance of integration, I/O density and reliable operation from −40 °C to 85 °C.
Key Features
- Core Logic Provides 2,304 logic elements (LEs) and an estimated 63,600 equivalent gates for implementing custom digital logic and control functions.
- Embedded Memory Includes 36,864 total RAM bits for on-chip data buffering, small lookup tables and state storage.
- I/O Capacity Up to 171 general-purpose I/O pins to support dense interfacing with sensors, peripherals and external devices.
- Power Operates from a 4.5 V to 5.5 V supply range, simplifying integration into legacy 5 V systems and mixed-voltage platforms.
- Package & Mounting 208-BFQFP with exposed pad (supplier package: 208-SQFP2 (28x28)), optimized for surface-mount PCB assembly and thermal conduction through the exposed pad.
- Operating Range & Grade Industrial-grade device rated for operation from −40 °C to 85 °C, suitable for a wide range of industrial environments.
- Standards Compliance RoHS compliant for material and environmental conformity.
Typical Applications
- Industrial Control Suitable for control logic, I/O aggregation and interface bridging in factory automation and process control where extended temperature and industrial grade operation are required.
- Embedded Systems Use as a system glue-logic FPGA for managing peripheral interfaces, custom state machines and timing-critical tasks in embedded products.
- Communications & Networking Equipment Implement custom packet processing, protocol bridging or low-latency control functions that benefit from programmable logic and abundant I/O.
- Prototyping & OEM Modules Ideal for OEM designs and development platforms that need configurable logic density with accessible I/O and a standard 5 V supply domain.
Unique Advantages
- Compact, deployable logic density: 2,304 logic elements provide a practical balance of gate count and placement for mid-scale logic integration without excessive board area.
- On-chip memory for local buffering: 36,864 bits of embedded RAM reduce dependence on external memory for small data storage and state retention.
- High I/O count: 171 I/O pins enable direct connection to multiple peripherals and interfaces, lowering the need for external multiplexers or expanders.
- Robust industrial operation: Rated for −40 °C to 85 °C and labeled industrial grade, supporting deployments in harsher ambient conditions.
- Standard 5 V compatibility: Operation from 4.5 V to 5.5 V simplifies integration with legacy 5 V logic and industrial power rails.
- Thermally conscious package: 208-BFQFP with exposed pad and surface-mount mounting improves PCB thermal performance and ease of assembly.
Why Choose OR2C26A4PS208I-DB?
The OR2C26A4PS208I-DB positions itself as a practical mid-density FPGA option for designers who need a combination of configurable logic, embedded RAM and a high I/O count in an industrial-grade package. Its 2,304 logic elements, 36,864 bits of RAM and 171 I/O make it well suited to embedded control, interface bridging and communications tasks where integration and reliable operation across −40 °C to 85 °C matter.
For engineering teams and OEMs targeting robust, 5 V-compatible systems, this ORCA™2 device offers a clear balance of integration, thermal-aware packaging and standards compliance to streamline development and reduce system BOM complexity.
Request a quote or submit an inquiry to receive pricing and availability for the OR2C26A4PS208I-DB ORCA™2 FPGA for your next design.