OR2C26A4PS208I-DB

FPGA, 576 CLBS, 27600 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 171 36864 2304 208-BFQFP Exposed Pad

Quantity 653 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-SQFP2 (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFP Exposed PadNumber of I/O171Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells2304
Number of Gates63600ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of OR2C26A4PS208I-DB – ORCA™2 FPGA, 2304 logic elements, 171 I/O

The OR2C26A4PS208I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, providing a compact, configurable logic solution for industrial-grade embedded designs. It combines 2,304 logic elements, 36,864 bits of on-chip RAM and up to 171 general-purpose I/O pins in a 208-BFQFP exposed pad package.

Designed for systems that require flexible programmable logic with a standard 4.5 V to 5.5 V supply and extended operating range, this device targets industrial control and embedded applications that need a balance of integration, I/O density and reliable operation from −40 °C to 85 °C.

Key Features

  • Core Logic  Provides 2,304 logic elements (LEs) and an estimated 63,600 equivalent gates for implementing custom digital logic and control functions.
  • Embedded Memory  Includes 36,864 total RAM bits for on-chip data buffering, small lookup tables and state storage.
  • I/O Capacity  Up to 171 general-purpose I/O pins to support dense interfacing with sensors, peripherals and external devices.
  • Power  Operates from a 4.5 V to 5.5 V supply range, simplifying integration into legacy 5 V systems and mixed-voltage platforms.
  • Package & Mounting  208-BFQFP with exposed pad (supplier package: 208-SQFP2 (28x28)), optimized for surface-mount PCB assembly and thermal conduction through the exposed pad.
  • Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 85 °C, suitable for a wide range of industrial environments.
  • Standards Compliance  RoHS compliant for material and environmental conformity.

Typical Applications

  • Industrial Control  Suitable for control logic, I/O aggregation and interface bridging in factory automation and process control where extended temperature and industrial grade operation are required.
  • Embedded Systems  Use as a system glue-logic FPGA for managing peripheral interfaces, custom state machines and timing-critical tasks in embedded products.
  • Communications & Networking Equipment  Implement custom packet processing, protocol bridging or low-latency control functions that benefit from programmable logic and abundant I/O.
  • Prototyping & OEM Modules  Ideal for OEM designs and development platforms that need configurable logic density with accessible I/O and a standard 5 V supply domain.

Unique Advantages

  • Compact, deployable logic density: 2,304 logic elements provide a practical balance of gate count and placement for mid-scale logic integration without excessive board area.
  • On-chip memory for local buffering: 36,864 bits of embedded RAM reduce dependence on external memory for small data storage and state retention.
  • High I/O count: 171 I/O pins enable direct connection to multiple peripherals and interfaces, lowering the need for external multiplexers or expanders.
  • Robust industrial operation: Rated for −40 °C to 85 °C and labeled industrial grade, supporting deployments in harsher ambient conditions.
  • Standard 5 V compatibility: Operation from 4.5 V to 5.5 V simplifies integration with legacy 5 V logic and industrial power rails.
  • Thermally conscious package: 208-BFQFP with exposed pad and surface-mount mounting improves PCB thermal performance and ease of assembly.

Why Choose OR2C26A4PS208I-DB?

The OR2C26A4PS208I-DB positions itself as a practical mid-density FPGA option for designers who need a combination of configurable logic, embedded RAM and a high I/O count in an industrial-grade package. Its 2,304 logic elements, 36,864 bits of RAM and 171 I/O make it well suited to embedded control, interface bridging and communications tasks where integration and reliable operation across −40 °C to 85 °C matter.

For engineering teams and OEMs targeting robust, 5 V-compatible systems, this ORCA™2 device offers a clear balance of integration, thermal-aware packaging and standards compliance to streamline development and reduce system BOM complexity.

Request a quote or submit an inquiry to receive pricing and availability for the OR2C26A4PS208I-DB ORCA™2 FPGA for your next design.

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